esda14v2-2bf3 STMicroelectronics, esda14v2-2bf3 Datasheet
esda14v2-2bf3
Available stocks
Related parts for esda14v2-2bf3
esda14v2-2bf3 Summary of contents
Page 1
... Communication systems and cellular phones ■ Video equipment This device is particularly adapted to the protection of symmetrical signals. Description The ESDA14V2-2BF3 is a monolithic array designed to protect 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. ...
Page 2
... MIL STD 883E - Method 3015-7 IEC61000-4-2 air discharge IEC61000-4-2 contact discharge = 25 °C) amb max. max µA 0 0.1 ESDA14V2-2BF3 Value ± 25 ± 15 ± 125 -55 to +150 260 -40 to +125 Slope (1) (2) typ ...
Page 3
... ESDA14V2-2BF3 Figure 1. Relative variation of peak pulse power versus intial junction temperature 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 T (° Figure 3. Clamping voltage versus peak pulse current (typical values, rectangular waveform) 10.0 tp=2.5µs Tj initial =25°C 1.0 V ( Figure 5. Relative variation of leakage current versus junction temperature (typical values) ...
Page 4
... Characteristics Figure 7. ESD response to IEC61000-4-2 (+15 kV air discharge) Figure 8. ESD response to IEC61000-4-2 (-15 kV air discharge) 4/9 ESDA14V2-2BF3 ...
Page 5
... ESDA14V2-2BF3 Figure 9. Digital crosstalk measurements Figure 10. Aplac model MODEL = D01 MODEL = D02 Lg nd Rgnd Model D01 aplacvar Ls 150 p BV=1 aplacvar IBV=1 CJO=12.5 aplacvar Lgnd 290 p M=0.33 aplacvar Rgnd 250 m RS=0.3 VJ=0.6 TT=100 1 Characteristics MODEL = D01 B2 Rgnd Lgnd Model D02 BV=1 IBV=1 CJO=250 M=0 ...
Page 6
... Ordering information scheme 2 Ordering information scheme ESD Array Breakdown Voltage 14V2 = 14.2 Volts min. Number of line lines Type B = Bidirectional Package F = Flip-Chip Lead free, Pitch = 400 µm, Bump height = 205 µm 6/9 ESDA14V2-2BF3 ESDA 14V2 - ...
Page 7
... ESDA14V2-2BF3 3 Package information Figure 11. Mechanical data 400 µm ± 40 185 µm ± 10 Figure 12. Footprint recommendations Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended Figure 14. Flip-Chip tape and reel specifications ...
Page 8
... ECOPACK trademark. ECOPACK specifications are available at: www.st.com. 4 Ordering information Part number ESDA14V2-2BF3 5 Revision history Date Revision 02-Dec-2005 15-Dec-2005 8/9 Marking Package EG Flip-Chip 1 Initial release. 2 Ordering information changed. ESDA14V2-2BF3 Weight Base qty Delivery mode 0.79 mg 5000 Tape and reel 7” Changes ...
Page 9
... ESDA14V2-2BF3 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...