ESDA14V2-4BF STMICROELECTRONICS [STMicroelectronics], ESDA14V2-4BF Datasheet
ESDA14V2-4BF
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ESDA14V2-4BF Summary of contents
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... Pin layout (bump side Figure 2. Configuration A3 A1 GND Description The ESDA14V2-4BF3 is a monolithic array designed to protect lines in a bidirectional way against ESD transients.The device is ideal for situations where board space saving is requested. This device is particularly adapted to the protection of symmetrical signals. Rev 3 1 ...
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... Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Capacitance min. max 2.5 µs. p -25 ° (25 °C) amb BR ESDA14V2-4BF3 Value ± 25 ± 15 ± 125 -55 to +150 260 -40 to +125 Slope ...
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... ESDA14V2-4BF3 Figure 3. Clamping voltage versus peak pulse current (T (Rectangular waveform, t 10.0 t =2.5 µ initial =25 °C j 1.0 0 Figure 5. Relative variation of leakage current versus junction temperature (typical values) 100 Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) Figure 4. initial = 25 ° 2.5 µ ...
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... Figure 10. Aplac model MODEL = D01 4 MODEL = D01 MODEL = D01 MODEL = D01 MODEL = D02 Rs Lgnd B2 ESDA14V2-4BF3 aplacvar Ls 290pH aplacvar Lgnd 130pH aplacvar Rs 100m Model D01 Model D02 BV=16 BV=16 IBV=1m IBV=1m CJO=12p CJO=320p M=0.333 M=0.333 RS=2.9 RS=80m VJ=0.6 VJ=0.6 TT=100n TT=100n ...
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... ESDA14V2-4BF3 3 Ordering information scheme Figure 11. Ordering information scheme ESD Array Breakdown Voltage 14V2 = 14.2 Volts min. Number of line lines Type B = Bidirectional Package F = Flip Chip lead-free, pitch = 400µm, bump height = 255 µm 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages ...
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... Order code ESDA14V2-4BF3 6/8 Figure 14. Marking Dot xx = marking z = manufacturing location yww = datecode Dot identifying Pin A1 location 4 ± 0.1 1.04 User direction of unreeling Marking Package Weight EF Flip Chip 1.10 mg ESDA14V2-4BF3 (y = year ww = week Ø 1.5 ± 0.1 4 ± 0.1 Base qty Delivery mode 5000 Tape and reel 7” ...
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... ESDA14V2-4BF3 6 Revision history Table 4. Document revision history Date Revision 19-Sep-2005 15-Dec-2005 18-Apr-2008 1 Initial release. Dimension from center bump to corner bump changed in Figure indicate diagonal instead of perpendicular measurement. No values changed. ECOPACK statement added. Updated ordering information. Updated ECOPACK statement. Updated 3 Figure 15. ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: time, without notice. SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. liability of ST. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com ESDA14V2-4BF3 ...