hx6256 Honeywell International's Solid State Electronics Center (SSEC), hx6256 Datasheet - Page 11

• Manufacturer Part Number: hx6256
• Description: 32k X 8 Static Ram Solid State Electronics Center
• Manufacturer: Honeywell International's Solid State Electronics Center (SSEC)

HX6256
PACKAGING
The 32K x 8 SRAM is offered in two custom 36-lead flat
packs, a 28-Lead FP, or standard 28-lead DIP. Each
package is constructed of multilayer ceramic (Al
features internal power and ground planes. The 36-lead
flat packs also feature a non-conductive ceramic tie bar
on the lead frame. The tie bar allows electrical testing of
the device, while preserving the lead integrity during
shipping and handling, up to the point of lead forming
and insertion.
28-LEAD DIP & FP PINOUT
28-LEAD FLAT PACK
28-LEAD DIP
www.honeywell.com/radhard
For 28-Lead DIP description, see MIL-STD-1835, Type CDIP2-T28, Config. C, Dimensions D-10
(22017785-001)
(22017842-001)
2
O
3
) and
On the bottom brazed 36-lead FP, ceramic chip
capacitors can be mounted to the package by the user to
maximize supply noise decoupling and increase board
packing density. These capacitors connect to the internal
package power and ground planes. This design
minimizes resistance and inductance of the bond wire
and package. All NC (no connect) pins must be
connected to either VDD, VSS or an active driver to
prevent charge build up in the radiation environment.
36-LEAD FP PINOUT
[1] BSC – Basic lead spacing between centers
[2] Where lead is brazed to package
[3] Parts delivered with leads unformed
[4] Lid connected to VSS
E2
E3
W
C
D
G
Q
U
A
E
F
S
X
Y
b
e
L
All dimensions in inches
0.105 ± 0.015
0.017 ± 0.002
0.003 to 0.006
0.720 ± 0.008
0.050 ± 0.005 [1]
0.500 ± 0.007
0.380 ± 0.008
0.060 ref
0.650 ± 0.005 [2]
0.035 ± 0.004
0.295 min [3]
0.026 to 0.045
0.045 ± 0.010
0.130 ref
0.050 ref
0.075 ref
0.010 ref
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