mtsf3n03hdr2 Freescale Semiconductor, Inc, mtsf3n03hdr2 Datasheet
![no-image](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_sml.jpg)
mtsf3n03hdr2
Available stocks
Related parts for mtsf3n03hdr2
mtsf3n03hdr2 Summary of contents
Page 1
... AA AA MTSF3N03HDR2 Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. ...
Page 2
MTSF3N03HD MAXIMUM RATINGS ( unless otherwise noted) Drain–to–Source Voltage Drain–to–Gate Voltage ( 1.0 MΩ) Gate–to–Source Voltage — Continuous 1 inch SQ. FR–4 or G–10 PCB Figure 1 below Steady State Minimum FR–4 or G–10 ...
Page 3
ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( Vdc 250 µAdc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc, V ...
Page 4
MTSF3N03HD TYPICAL ELECTRICAL CHARACTERISTICS 4 3 2 DRAIN–TO–SOURCE VOLTAGE ...
Page 5
Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (∆t) are deter- mined by how fast the FET input capacitance can be charged by current from ...
Page 6
MTSF3N03HD TOTAL GATE CHARGE (nC) Figure 10. Gate–To–Source and Drain–To–Source Voltage versus Total Charge DRAIN–TO–SOURCE DIODE CHARACTERISTICS ...
Page 7
The Forward Biased Safe Operating Area curve (Figure 14) defines the maximum simultaneous drain–to–source vol- tage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a ...
Page 8
MTSF3N03HD TYPICAL ELECTRICAL CHARACTERISTICS 1000 D = 0.5 100 0.2 0.1 0.05 10 0.02 0.01 1.0 SINGLE PULSE 0.1 1.0E–05 1.0E–04 1.0E–03 Figure 17. Diode Reverse Recovery Waveform 8 P (pk DUTY CYCLE ...
Page 9
INFORMATION FOR USING THE Micro8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure ...
Page 10
MTSF3N03HD For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control ...
Page 11
Micro8 Dimensions are shown in millimeters (inches) 2.05 (.080) 1.95 (.077) 4.10 (.161) PIN NUMBER 1 3.90 (.154) 12.30 11.70 (.484) (.461) FEED DIRECTION NOTES: 1. CONFORMS TO EIA–481–1. 2. CONTROLLING DIMENSION: MILLIMETER. 330.0 (13.20) MAX. NOTES: 1. CONFORMS TO ...
Page 12
MTSF3N03HD –A– K PIN SEATING –T– PLANE 0.038 (0.0015) Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for ...