upa2352t1p Renesas Electronics Corporation., upa2352t1p Datasheet

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upa2352t1p

Manufacturer Part Number
upa2352t1p
Description
Dual Nch Mosfet
Manufacturer
Renesas Electronics Corporation.
Datasheet

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Part Number:
upa2352t1p-E4-A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Document No. G19741EJ1V0DS00 (1st edition)
Date Published April 2009 NS
Printed in Japan
DESCRIPTION
Lithium-Ion battery protection circuit.
(EFLIP).
FEATURES
ORDERING INFORMATION
Note Pb-free (This product does not contain Pb in external electrode and other parts.)
Remark "-E4" indicates the unit orientation (-E4 only).
ABSOLUTE MAXIMUM RATINGS (T
Source to Source Voltage (V
Gate to Source Voltage (V
Source Current (DC)
Source Current (pulse)
Total Power Dissipation (2 units)
Channel Temperature
Storage Temperature
Notes 1. Mounted on BT resin board of 40.5 mm x 25 mm x 1.5 mm
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When this
The
Ecologically Flip chip MOSFET for Lithium-Ion battery Protection
μ
Connecting the Drains on the circuit board is not required
because the Drains of the FET1 and the FET2 are internally
connected.
Monolithic Dual MOSFET
2.5 V drive available and low on-state resistance
R
R
R
R
Built-in G-S protection diode against ESD
Pb-free bump
PA2352T1P-E4-A
SS(on)1
SS(on)2
SS(on)3
SS(on)4
PART NUMBER
μ
2. PW ≤ 100
PA2352T1P is a Dual N-channel MOSFET designed for
device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage
may be applied to this device.
= 43.0 mΩ MAX. (V
= 45.0 mΩ MAX. (V
= 55.0 mΩ MAX. (V
= 67.0 mΩ MAX. (V
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Note
μ
Note1
s, Duty Cycle ≤ 1%
Note2
SS
GS
= 0 V)
GS
GS
GS
GS
= 0 V)
Note1
= 4.5 V, I
= 4.0 V, I
= 3.1 V, I
= 2.5 V, I
4-pin EFLIP-LGA
PACKAGE
V
V
I
I
P
T
T
S
S
S
S
A
S(DC)
S(pulse)
ch
stg
SSS
GSS
T
= 2.0 A)
= 2.0 A)
= 2.0 A)
= 2.0 A)
= 25°C)
DUAL Nch MOSFET
DATA SHEET
−55 to +150
±4.0
0.75
±12
±40
150
24
MOS FIELD EFFECT TRANSISTOR
°C
°C
W
V
V
A
A
1-pin index mark S1
μ
OUTLINE DRAWING (Unit: mm)
Source1
PA2352T1P
1.40 ± 0.05
TOP VIEW
FET1
Gate1
EQUIVALENT CIRCUIT
Dot area (For in-house)
Body Diode
0.2 ± 0.05
BOTTOM VIEW
FET2
Gate2
G1
G2
Source2
0.65
S2
S1
Gate
Protection
Diode
S1 : Source1
G1 : Gate1
G2 : Gate2
S2 : Source2
4 -
2009
φ
0.3
0.65

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upa2352t1p Summary of contents

Page 1

DESCRIPTION μ The PA2352T1P is a Dual N-channel MOSFET designed for Lithium-Ion battery protection circuit. Ecologically Flip chip MOSFET for Lithium-Ion battery Protection (EFLIP). FEATURES • Monolithic Dual MOSFET Connecting the Drains on the circuit board is not required because ...

Page 2

ELECTRICAL CHARACTERISTICS (T CHARACTERISTICS SYMBOL Zero Gate Voltage Source Current Gate Leakage Current Gate Cut-off Voltage Note Forward Transfer Admittance Source to Source On-state Note Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay ...

Page 3

TEST CIRCUIT 5 R SS(on TEST CIRCUIT 7 C iss Capacitance Capacitance Bridge Bridge S1 S1 TEST ...

Page 4

TYPICAL CHARACTERISTICS (T A DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 120 100 100 125 150 175 T - Ambient Temperature - °C A FORWARD BIAS SAFE OPERATING AREA 100 ...

Page 5

SOURCE CURRENT vs. SOURCE TO SOURCE VOLTAGE 4 4 TEST CIRCUIT 5 Pulsed Source to Source Voltage - V ...

Page 6

SOURCE TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 100 TEST CIRCUIT 2 2 Pulsed 3.1 V 4 Channel ...

Page 7

Example of application circuit > Lithium-Ion battery (1 cell) protection circuit Lithium-Ion battery pack Lithium-Ion battery pack Lithium- Lithium- Ion battery Ion battery cell cell <Notes for using this device safely> When you use this device, in order to ...

Page 8

Figure 1 Recommended soldering conditions of INFRARED REFLOW Maximum temperature (Package's surface temperature) Time at maximum temperature Time of temperature higher than 220°C Preheating time at 160 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux ...

Page 9

The information in this document is current as of April, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most ...

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