hmc527 Hittite Microwave Corporation, hmc527 Datasheet - Page 4

• Manufacturer Part Number: hmc527
• Description: Gaas Mmic I/q Mixer 8.5 - 13.5 Ghz
• Manufacturer: Hittite Microwave Corporation

Harmonics of LO
Absolute Maximum Ratings
Outline Drawing
LO = +19 dBm
Values in dBc below input LO level measured at RF Port.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 7.1 mW/°C above 85°C)
Thermal Resistance (R
(junction to die bottom)
Storage Temperature
Operating Temperature
LO Freq. (GHz)
10.5
12.5
13.5
11.5
8.5
9.5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
43
48
53
50
48
44
1
)
nLO Spur at RF Port
48
57
52
47
51
51
2
+20 dBm
+27 dBm
150°C
460 mW
140 °C/W
-65 to +150 °C
-55 to +85 deg °C
v01.1007
50
62
67
67
64
57
3
Order On-line at www.hittite.com
77
64
53
45
47
xx
4
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 10.6 GHz @ -10 dBm
LO = 10.5 GHz @ +19 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
GP-2
33
86
96
89
xx
0
GaAs MMIC I/Q MIXER
-11
77
95
94
1
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
UNLABELED BOND PADS.
nLO
101
53
96
16
76
2
8.5 - 13.5 GHz
HMC527
Alternate
101
22
62
78
91
[2]
3
[1]
102
107
38
95
94
4
3 - 111
3