hmc528 Hittite Microwave Corporation, hmc528 Datasheet - Page 4

• Manufacturer Part Number: hmc528
• Description: Gaas Mmic I/q Mixer / Irm Chip, 11 - 16 Ghz
• Manufacturer: Hittite Microwave Corporation

Harmonics of LO
Absolute Maximum Ratings
Outline Drawing
LO = +19 dBm
Values in dBc below input LO level measured at RF Port.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 6.9 mW/°C above 85°C)
Thermal Resistance (R
(junction to die bottom)
Storage Temperature
Operating Temperature
LO Freq. (GHz)
10.5
12.5
13.5
14.5
15.5
11.5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
43
49
50
49
50
49
1
)
nLO Spur at RF Port
49
52
48
54
47
51
2
+20 dBm
27 dBm
150°C
452 mW
150 °C/W
-65 to +150 °C
-55 to +85 deg °C
v01.0907
58
63
67
69
61
71
3
Order On-line at www.hittite.com
79
61
53
xx
xx
xx
4
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 13.6 GHz @ -10 dBm
LO = 13.5 GHz @ +19 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
GP-2
24
79
87
xx
xx
0
GaAs MMIC I/Q MIXER
102
-12
73
84
1
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
UNLABELED BOND PADS.
nLO
102
99
51
74
2
7
11 - 16 GHz
HMC528
Alternate
14
59
79
86
97
[2]
3
[1]
105
xx
70
91
97
4
3 - 117
3