hmc525 Hittite Microwave Corporation, hmc525 Datasheet - Page 4

• Manufacturer Part Number: hmc525
• Description: Gaas Mmic I/q Mixer 4.0 - 8.5 Ghz
• Manufacturer: Hittite Microwave Corporation

Harmonics of LO
Absolute Maximum Ratings
Outline Drawing
LO = +15 dBm
Values in dBc below input LO level measured at RF Port.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 9.7 mW/°C above 85°C)
Thermal Resistance (R
(junction to die bottom)
Storage Temperature
Operating Temperature
LO Freq. (GHz)
3.5
4.5
5.5
6.5
8.5
7.5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
40
43
51
59
48
44
1
)
nLO Spur at RF Port
40
45
57
63
66
65
2
+20 dBm
+27 dBm
150°C
631 mW
103 °C/W
-65 to +150 °C
-55 to +85 deg °C
v01.1007
54
58
48
64
64
60
3
Order On-line at www.hittite.com
50
53
67
56
62
67
4
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 5.6 GHz @ -10 dBm
LO = 5.5 GHz @ +15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
GP-2
32
89
89
89
xx
0
GaAs MMIC I/Q MIXER
-11
62
89
89
1
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
UNLABELED BOND PADS.
nLO
32
42
89
89
74
2
4.0 - 8.5 GHz
HMC525
Alternate
23
51
65
82
89
[2]
3
[1]
51
66
89
89
89
4
3 - 99
3