hmc578 Hittite Microwave Corporation, hmc578 Datasheet - Page 4
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hmc578
Manufacturer Part Number
hmc578
Description
Gaas Mmic X2 Active Frequency Multiplier, 24 - 33 Ghz Output
Manufacturer
Hittite Microwave Corporation
Datasheet
1.HMC578.pdf
(6 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HMC578
Manufacturer:
MINI
Quantity:
5 000
Part Number:
HMC578
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
hmc578LC3B
Manufacturer:
TYCO
Quantity:
10
Part Number:
hmc578LC3B
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
hmc578LC3BETR
Manufacturer:
HITTITE
Quantity:
12 800
Absolute Maximum Ratings
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] Reference this suffix only when ordering alternate die
packaging.
RF Input (Vdd = +5V)
Supply Voltage (Vdd1, Vdd2)
Channel Temperature
Continuous Pdiss (T= 85 °C)
(derate 7.8 mW/°C above 85 °C)
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
Standard
GP-2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
+13 dBm
+6.0 Vdc
175 °C
703 mW
128 °C/W
-65 to +150 °C
-55 to +85 °C
Alternate [2]
v00.0506
—
Order On-line at www.hittite.com
[1]
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 24 - 33 GHz OUTPUT
Typical Supply Current vs. Vdd
Note:
Multiplier will operate over full voltage range shown above.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE.
4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METALIZATION: GOLD
7. BACKSIDE METAL IS GROUND.
8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.
Vdd (Vdc)
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
4.5
5.0
5.5
HMC578
Idd (mA)
81
81
81
2 - 59
2