hmc559 Hittite Microwave Corporation, hmc559 Datasheet - Page 5

• Manufacturer Part Number: hmc559
• Description: Wideband Power Amplifier Chip, Dc - 20 Ghz
• Manufacturer: Hittite Microwave Corporation

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3
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Standard
GP-1
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Alternate
v03.0208
[2]
Order On-line at www.hittite.com
[1]
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. DIE THICKNESS IS 0.004 (0.100)
3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE
4. BOND PAD METALIZATION: GOLD
5. BACKSIDE METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS
8. OVERALL DIE SIZE IS ±.002
POWER AMPLIFIER, DC - 20 GHz
GaAs PHEMT MMIC
HMC559