hmc566lp4e Hittite Microwave Corporation, hmc566lp4e Datasheet
hmc566lp4e
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hmc566lp4e Summary of contents
Page 1
... MCM assemblies due to its compact size, single +3V supply operation, and DC blocked RF I/O’s. The RoHS packaged HMC566LP4E eliminates the need for wirebonding and allows the use of high volume surface mount manufacturing techniques. The HMC566LP4E is also available in chip form as the HMC566 +25° C, Vdd +3V A Min ...
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... Output Return Loss vs. Temperature 0 -5 -10 -15 - Reverse Isolation vs. Temperature 0 -10 -20 -30 -40 -50 -60 - Order On-line at www.hittite.com HMC566LP4E + FREQUENCY (GHz) + FREQUENCY (GHz) + ...
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... Channel Temperature 7 Continuous Pdiss (T= 85 °C) 6 (derate 9.6 mW/°C above 85 °C) 5 Thermal Resistance 4 (channel to ground paddle) 3 Noise Figure Storage Temperature 2 1 Operating Temperature 0 3 3.5 Order On-line at www.hittite.com HMC566LP4E AMPLIFIER GHz + FREQUENCY (GHz) ...
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... GaAs pHEMT MMIC LOW NOISE AMPLIFIER GHz Description This pins and exposed ground paddle must be connected to RF/DC ground. This pin is AC coupled and matched to 50 Ohms. No Connection This pin is AC coupled and matched to 50 Ohms. Order On-line at www.hittite.com HMC566LP4E 8 Interface Schematic 8 - 193 ...
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... PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Package Body Material RoHS-compliant Low Stress Injection Molded Plastic Order On-line at www.hittite.com HMC566LP4E AMPLIFIER GHz [1] Lead Finish Package Marking H566 ...
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... A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. Order On-line at www.hittite.com HMC566LP4E 195 ...