h5ps2g43afr Hynix Semiconductor, h5ps2g43afr Datasheet

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h5ps2g43afr

Manufacturer Part Number
h5ps2g43afr
Description
Ddr2 Sdram
Manufacturer
Hynix Semiconductor
Datasheet

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Part Number:
h5ps2g43afr-S6C
Manufacturer:
HYNIX
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9 500
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.1 / November 2008
Lead-Free&Halogen-Free
2Gb DDR2 SDRAM
(RoHS Compliant)
H5PS2G43AFR
H5PS2G83AFR
H5PS2G43AFR
H5PS2G83AFR
1

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h5ps2g43afr Summary of contents

Page 1

... DDR2 SDRAM Lead-Free&Halogen-Free This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev. 0.1 / November 2008 (RoHS Compliant) H5PS2G43AFR H5PS2G83AFR H5PS2G43AFR H5PS2G83AFR 1 ...

Page 2

... Revision Details Rev. 0.1 Initial data sheet released Rev. 0.1 / November 2008 History H5PS2G43AFR H5PS2G83AFR Draft Date Nov. 2008 2 ...

Page 3

... Input AC Logic Level 3.2.3 AC Input Test Conditions 3.2.4 Differential Input AC Logic Level 3.2.5 Differential AC Output Parameters 3.3 Output Buffer Levels 3.3.1 Output AC Test Conditions 3.3.2 Output DC Current Drive 3.3.3 OCD default characteristics 3.4 IDD Specifications & Measurement Conditions 3.5 Input/Output Capacitance 4. AC Timing Specifications 5. Package Dimensions Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR 3 ...

Page 4

... JEDEC standard 60ball FBGA(x4/x8) • Full strength driver option controlled by EMR • On Die Termination supported • Off Chip Driver Impedance Adjustment supported • Read Data Strobe supported (x8 only) • Self-Refresh High Temperature Entry Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR 4 ...

Page 5

... Operating Frequency table for complete part number. Hynix lead & halogen-free products are compliant to RoHS. Operating Frequency Grade tCK(ns 2.5 S5 2.5 Rev. 0.1 / November 2008 Configuration Package 512Mx4 60 Ball 256Mx8 CL tRCD H5PS2G43AFR H5PS2G83AFR tRP Unit Clk 5 Clk 6 Clk 5 5 ...

Page 6

... VSS VDDQ C DQ3 D E VSS BA1 A14 ITEMS # of Bank Page size H5PS2G43AFR H5PS2G83AFR VSSQ DQS VDDQ DQS VSSQ NC VDDQ DQ0 VDDQ DQ2 VSSQ NC VSSDL CK VDD RAS CK ODT CAS VDD A6 A4 A11 ...

Page 7

... A DM/RDQS B VDDQ C DQ3 D E VSS BA1 A14 ITEMS # of Bank BA0, BA1, BA2 Page size H5PS2G43AFR H5PS2G83AFR VSSQ DQS VDDQ DQS VSSQ DQ7 VDDQ DQ0 VDDQ DQ2 VSSQ DQ5 VSSDL CK VDD RAS CK ODT CAS VDD ...

Page 8

... LDQS/LDQS and UDQS/UDQS "single-ended DQS signals" refers to any of the following with A10 = 1 of EMR(1) x4 DQS x8 DQS x8 DQS, RDQS, x16 LDQS and UDQS H5PS2G43AFR H5PS2G83AFR DESCRIPTION has become stable during the power on and initialization if EMR(1)[A11 EMR(1)[A11 EMR(1)[A11 ...

Page 9

... TYPE NC V Supply DDQ VSSQ Supply V Supply DDL V Supply SSDL VDD Supply V Supply SS V Supply REF Rev. 0.1 / November 2008 No Connect: No internal electrical connection is present. DQ Power Supply: 1.8V +/- 0.1V DQ Ground DLL Power Supply: 1.8V +/- 0.1V DLL Ground Power Supply: 1.8V +/- 0.1V Ground Reference voltage. H5PS2G43AFR H5PS2G83AFR -Continued- DESCRIPTION 9 ...

Page 10

... JESD51-2 standard 85~95° Double refresh rate(tREFI: 3.9us) is required, and to enter the self refresh mode at this tem- OPER perature range it must be required an EMRS command to change itself refresh rate. Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR Rating Units - ...

Page 11

... V (ac) to test pin separately, then measure current I (ac), and VDDQ values defined in SSTL_18 IL V (ac (ac Rtt(eff) = I(V (ac delta 100% VDDQ H5PS2G43AFR H5PS2G83AFR Units Max. 1.9 V 1.9 V 1.9 V 0.51*VDDQ mV VREF+0.04 V MIN NOM MAX UNITS NOTES ohm 120 ...

Page 12

... Figure: AC Input Test Signal Waveform> Rev. 0.1 / November 2008 Min. VREF + 0.125 - 0.3 DDR2 667,800 Min. VREF + 0.200 - Condition to V max for falling edges as shown in the figure below. IL(ac) delta TR max IL(ac) Rising Slew = H5PS2G43AFR H5PS2G83AFR Max. Units VDDQ + 0.3 V VREF - 0.125 V Units Max VREF - 0.200 V Value Units 0 ...

Page 13

... VDDQ. VOX(AC) indicates the voltage at which differential output signals must cross. Rev. 0.1 / November 2008 Min. 0.5 0.5 * VDDQ - 0.175 0.5 * VDDQ + 0.175 V DDQ SSQ < Differential signal levels > Min. 0.5 * VDDQ - 0.125 0.5 * VDDQ + 0.125 H5PS2G43AFR H5PS2G83AFR Max. Units Notes VDDQ + 0 Crossing point Max. Units Notes ...

Page 14

... V OUT DDQ OH /I must be less than 21 ohm for values of V OUT OL TT are based on the conditions given in Notes 1 and 2. They are used to test min plus a noise margin and V IH H5PS2G43AFR H5PS2G83AFR SSTL_18 Class II Units 0 DDQ SSTl_18 Units - 13.4 mA 13.4 ...

Page 15

... DRAM output slew rate specification applies to 400, 533 and 667 MT/s speed bins. 8. Timing skew due to DRAM output slew rate mis-match between DQS / DQS and associated DQs is included in tDQSQ and tQHS specification. Rev. 0.1 / November 2008 Parameter Min - 0 0 Sout 1.5 VTT 25 ohms Reference point H5PS2G43AFR H5PS2G83AFR Nom Max Unit Notes - - ohms 1 1.5 ohms 6 4 ohms ...

Page 16

... IDD3P S IDD3N IDD4W IDD4R IDD5 Normal IDD6 Low power IDD7 Rev. 0.1 / November 2008 DDR2 667 x4/x8 90 100 200 185 220 15 8 280 H5PS2G43AFR H5PS2G83AFR DDR2 800 Units x4/ 105 240 mA 220 mA 230 mA 15 ...

Page 17

... RCD = 1* t CK(IDD); CKE is HIGH HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDD4R; - Refer to the following page for detailed timing conditions Rev. 0.1 / November 2008 Conditions Fast PDN Exit MR(12 Slow PDN Exit MR(12 H5PS2G43AFR H5PS2G83AFR Units ...

Page 18

... SWITCHING is defined as: inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and control signals, and inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including masks or strobes. Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR 18 ...

Page 19

... A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 RA4 D A5 RA5 D A6 RA6 D A7 RA7 Rev. 0.1 / November 2008 DDR2-800 5-5-5 6-6 12.5 15 57.5 60 7.5 7 2.5 2 70000 70000 12 105 105 127.5 127.5 197.5 197.5 327.5 327.5 H5PS2G43AFR H5PS2G83AFR DDR2-667 5-5-5 Units 5 tCK 7 70000 105 ns 127.5 ns 197.5 ns 327.5 327.5 ...

Page 20

... Input capacitance delta, all other input-only pins Input/output capacitance, DQ, DM, DQS, DQS Input/output capacitance delta, DQ, DM, DQS, DQS Rev. 0.1 / November 2008 DDR2 667 Symbol Min Max CCK 1.0 2.0 CDCK x 0.25 CI 1.0 2.0 CDI x 0.25 CIO 2.5 3.5 CDIO x 0.5 H5PS2G43AFR H5PS2G83AFR DDR2 800 Units Min Max 1.0 2 0.25 pF 1.0 1. 0.25 pF 2 ...

Page 21

... DD 256Mb 512Mb 1Gb Symbol tRFC 75 0 ℃≤ T ≤ 85℃ 7.8 CASE ≤ 95℃ 3.9 85℃< T CASE DDR2-800 min min 5-5-5 6-6 12 57.5 60 H5PS2G43AFR H5PS2G83AFR 2Gb 4Gb Units Notes 105 127.5 195 327.5 7.8 7.8 7.8 7.8 3.9 3.9 3.9 3.9 DDR2-667 Units min min 4-4-4 5-5 tCK ...

Page 22

... WR+tnRP - tFAW 37.5 - H5PS2G43AFR H5PS2G83AFR DDR2-800 Unit min max -400 +400 ps -350 +350 ps 0.48 0.52 tCK(av g) 0.48 0.52 tCK(av g) min(tCL(ab s tCH(abs)) 2500 8000 ps 6,7,8,20,28 6,7,8,21,28, 125 - ps tCK(av 0 tCK(av ...

Page 23

... CK tDelay (avg) + tIH H5PS2G43AFR H5PS2G83AFR DDR2-800 Unit Notes min max nCK tCK(av 0.4 0 4,32 tCK(av 0.4 0.6 19, 70000 ns 5,7,9,2 175 ...

Page 24

... Output slew rate is characterized under the test conditions as shown below. VDDQ DUT Rev. 0.1 / November 2008 DQ DQS Output DQS RDQS Timing 25 RDQS reference point AC Timing Reference Load DQ Output DQS, DQS RDQS, RDQS 25 Test point Slew Rate Test Load H5PS2G43AFR H5PS2G83AFR DDQ Ω DDQ Ω 24 ...

Page 25

... (ac (ac) IH DMin DMin V (ac) IL Figure -- Data input (write) timing RPRE Q t DQSQmax t QH Figure -- Data output (read) timing H5PS2G43AFR H5PS2G83AFR t WPST V (dc (dc (dc) IH DMin DMin V (dc RPST ...

Page 26

... H5PS2G43AFR H5PS2G83AFR 1.4 V/ns 1.2 V/ns 1.0 V/ns △ △ △ △ △ △ tDH tDS tDH tDS tDH tDS - - - - - - - - - - - - - -59 2 -47 14 ...

Page 27

... VIH/IL(ac). For slew rate in between the values listed in table x, the derating valued may obtained by linear interpolation. These values are typically not subject to production test. They are verified by design and characterization. Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR 27 ...

Page 28

... Delta TF Setup Slew Rate V = Falling Signal Rev. 0.1 / November 2008 nominal slew rate Delta TR (dc)-V (ac)max Setup Slew Rate REF IL Rising Signal Delta TF H5PS2G43AFR H5PS2G83AFR nominal slew rate REF region V (ac)min-V (dc) REF IH = Delta TR 28 ...

Page 29

... Tangent line[V = Falling Signal Rev. 0.1 / November 2008 nominal line Tangent line Delta TR Setup Slew Rate Tangent line[V = Rising Signal (dc)-V (ac)max] REF IL Delta TF H5PS2G43AFR H5PS2G83AFR tangent line REF region (ac)min-V (dc)] REF IH Delta TR 29 ...

Page 30

... Hold Slew Rate = Rising Signal Rev. 0.1 / November 2008 REF nominal slew rate Delta TR (dc)-V (dc)max Hold Slew Rate REF IL Falling Signal Delta TR H5PS2G43AFR H5PS2G83AFR nominal slew rate Delta TF V (dc)min - V (dc) IH REF = Delta TF 30 ...

Page 31

... Tangent line[V = Rising Signal Rev. 0.1 / November 2008 Tangent nominal line line Delta TR (dc)-V (ac)max] REF IL Delta TR Hold Slew Rate = Falling Signal H5PS2G43AFR H5PS2G83AFR nominal line tangent line Delta TF Tangent line[V (ac)min-V (dc)] REF IH Delta TF 31 ...

Page 32

... Hold(tIH) nominal slew rate for a falling signal is defined as the REF (dc). If the actual signal is always later than the nominal slew rate REF (dc) region’, use nominal slew rate for derating value(see Fig.c) If the actual H5PS2G43AFR H5PS2G83AFR 1.0 V/ns △ tIS △ tIH ...

Page 33

... Below figure shows a method to calculate the point when device is no longer driving (tHZ), or begins driving (tLZ) by measuring the signal at two different voltages. The actual voltage measure- ment points are not critical as long as the calculation is consistent. Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR 33 ...

Page 34

... VTT + 2xmV VOH + 2xmV T2 VOL + 1xmV VTT - 2xmV VOL + 2xmV (ac) level to the differential data strobe crosspoint for a falling signal applied to Differential Input waveform timing tDS tDH tDS H5PS2G43AFR H5PS2G83AFR VTT + xmV tLZ tRPRE begin point T1 VTT -xmV T2 tLZ , tRPRE begin point = 2*T1-T2 tDH V ...

Page 35

... For these parameters, the DDR2 SDRAM device is characterized and verified to support tnPARAM = RU {tPARAM / tCK (avg)}, which is in clock cycles, assuming all input clock jitter specifications Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR (ac) level for a rising sig- IH ...

Page 36

... H5PS2G43AFR H5PS2G83AFR DDR2-800 Units Notes min max -100 100 -200 200 ps 35 -160 160 ...

Page 37

... H5PS2G43AFR H5PS2G83AFR max Units tCK (avg), max + tJIT (per), max ps tCH (avg), max* tCK (avg), max ...

Page 38

... HIGH pulse width of 0.5 relative to tCK (avg). tAOF, min and tAOF, max should each be derated by the same amount as the actual amount of tCH (avg) offset present at the DRAM input with respect to 0.5. For example input clock has a worst case tCH (avg) of 0.48, the tAOF, min should be derated by sub- Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR 38 ...

Page 39

... Thus the final derated values for tAOF are; tAOF, min (derated_final) = tAOF, min (derated tJIT (duty), max - tERR(6-10per),max} tAOF, max (derated_final) = tAOF, max (derated tJIT (duty), min - tERR(6-10per),min} Rev. 0.1 / November 2008 H5PS2G43AFR H5PS2G83AFR 39 ...

Page 40

... Fine Pitch Ball Grid Array Outline A1 CORNER 11.00 ± 0.10 INDEX AREA (2.75) <Top View> 8.00X8=6.40 0.80 2.10 ± 0. 60Xφ0.45 ± 0.05 <Back View> Rev. 0.1 / November 2008 2.30 ± 0.10 A1 BALL MARK 1.60 1.60 H5PS2G43AFR H5PS2G83AFR 2-R0.13MAX <SIDE View> 1.10 0.10 ± 0.34 ± 0.05 Note: All Dimensions are in millimeters. 40 ...

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