GTL2003 Philips Semiconductors (Acquired by NXP), GTL2003 Datasheet - Page 13

• Manufacturer Part Number: GTL2003
• Manufacturer: Philips Semiconductors (Acquired by NXP)

NXP Semiconductors
14. Package outline
Fig 11. Package outline SOT360-1 (TSSOP20)
GTL2003_1
Product data sheet
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT360-1
max.
1.1
A
0.15
0.05
A
1
20
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
D
6.6
6.4
0
(1)
Rev. 01 — 27 July 2007
11
10
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
8-bit bidirectional low voltage translator
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
X
v
GTL2003
0.1
A
© NXP B.V. 2007. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-19
Z
0.5
0.2
(1)
SOT360-1
8
0
o
o
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