GTL2003 Philips Semiconductors (Acquired by NXP), GTL2003 Datasheet - Page 17

• Manufacturer Part Number: GTL2003
• Manufacturer: Philips Semiconductors (Acquired by NXP)

NXP Semiconductors
16. Abbreviations
17. Revision history
Table 16.
GTL2003_1
Product data sheet
Document ID
GTL2003_1
Revision history
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 15.
Acronym
CDM
CMOS
DUT
ESD
GTL
HBM
I
LVTTL
MM
NMOS
TTL
TVC
2
Fig 13. Temperature profiles for large and small components
C-bus
Release date
20070727
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
Device Under Test
ElectroStatic Discharge
Gunning Transceiver Logic
Human Body Model
Inter-Integrated Circuit bus
Low Voltage Transistor-Transistor Logic
Machine Model
Negative-channel Metal Oxide Semiconductor
Transistor-Transistor Logic
Transceiver Voltage Clamps
Data sheet status
Product data sheet
Rev. 01 — 27 July 2007
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
8-bit bidirectional low voltage translator
Change notice
-
temperature
Supersedes
-
peak
GTL2003
© NXP B.V. 2007. All rights reserved.
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