CE71J7 FUJITSU [Fujitsu Component Limited.], CE71J7 Datasheet
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CE71J7
Related parts for CE71J7
CE71J7 Summary of contents
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... J-Series with 66µm Stagger Pad Pitch and Wire Bonding Frame Total Gates CE71J1 216K CE71J2 312K CE71J3 488K CE71J4 703K CE71J5 911K CE71J6 1,098K CE71J7 1,302K CE71J8 1,524K CE71J9 2.020K CE71JA 2,586K CE71JB 3,055K CE71JC 3,564K CE71JD 4,113K CE71JE 5,114K ...
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CE71 Series Embedded Array L-Series with 44µm Inline Pad Pitch and Au Bump Frame Total Gates Total Pads CE71L4 356K 304 CE71L5 476K 352 CE71L6 677K 420 CE71L7 1,034K 520 CE71L8 1,469K 620 CE71L9 1,976K 720 CE71LA 2,513K 812 CE71LB ...
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PACKAGE AVAILABILITY No. of Pins Frame Size Thin and Low Profile QFP Packages (0.4, 0.5 mm lead pitch) 100 K1, K2 120 K2, K3 144 K3, K4, K8, T2, T3 176 K4, K5, T3, T4 208 T4, T5, T6, T7, ...
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FUJITSU MICROELECTRONICS AMERICA, INC. Corporate Headquarters 1250 East Arques Avenue, Sunnyvale, California 94088-3470 Tel: (800) 866-8608 Fax: (408) 737-5999 E-mail: inquiry@fma.fujitsu.com Web Site: http://www.fma.fujitsu.com © 1999 Fujitsu Microelectronics, Inc. All company and product names are trademarks or registered trademarks of ...