MMBFJ175LT1_06 ONSEMI [ON Semiconductor], MMBFJ175LT1_06 Datasheet

MMBFJ175LT1_06

Manufacturer Part Number

MMBFJ175LT1_06

Description

JFET Chopper P-Channel - Depletion

Manufacturer

ONSEMI [ON Semiconductor]

Datasheet

1.MMBFJ175LT1_06.pdf (2 pages)

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MMBFJ175LT1

JFET Chopper

P−Channel − Depletion

Features

•

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.062 in.

2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.

February, 2006 − Rev. 3

MAXIMUM RATINGS

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS

OFF CHARACTERISTICS

ON CHARACTERISTICS

Drain−Gate Voltage

Reverse Gate−Source Voltage

Total Device Dissipation FR−5 Board,

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature

Gate −Source Breakdown Voltage

Gate Reverse Current

Gate −Source Cutoff Voltage

Zero Gate−Voltage Drain Current (Note 2)

Drain Cutoff Current

Drain Source On Resistance

Input Capacitance

Reverse Transfer

Capacitance

Pb−Free Package is Available

(Note 1) T

Derate above 25°C

= 500 mA)

= 0, I

= 0 V, V

= 15, I

= 0, V

= 15 V, V

Characteristic

= 1.0 mA)

= 25°C

Rating

= 10 nA)

= 15 V)

= 20 V)

= 10 V)

f = 1.0 MHz

= 0, V

Preferred Device

= 10V

Symbol

= 25°C unless otherwise noted)

Symbol

(BR)GSS

GS(OFF)

DS(on)

D(off)

GSS

DSS

GS(r)

, T

rss

qJA

iss

stg

−55 to +150

Min

3.0

7.0

−

Value

Max

−25

225

556

1.8

Max

125

1.0

6.0

1.0

5.5

−

mW/°C

°C/W

Unit

°C

†For information on tape and reel specifications,

MMBFJ175LT1

MMBFJ175LT1G

Preferred devices are recommended choices for future use

and best overall value.

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*Date Code orientation and/or overbar may

Device

vary depending upon manufacturing location.

(Note: Microdot may be in either location)

ORDERING INFORMATION

GATE

MARKING DIAGRAM

http://onsemi.com

= Device Code

= Date Code*

= Pb−Free Package

(Pb−Free)

Package

SOT−23

6W M G

Publication Order Number:

SOT−23 (TO−236)

1 DRAIN

2 SOURCE

CASE 318

STYLE 10

3,000 / Tape & Reel

MMBFJ175LT1/D

Shipping

†

Related parts for MMBFJ175LT1_06

MMBFJ175LT1_06 Summary of contents

Page 1

MMBFJ175LT1 Preferred Device JFET Chopper P−Channel − Depletion Features • Pb−Free Package is Available MAXIMUM RATINGS Rating Drain−Gate Voltage Reverse Gate−Source Voltage THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR−5 Board, (Note 25°C A Derate above 25°C Thermal ...

Page 2

D SEE VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are ...

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