mas9283axtg00 Micro Analog Systems Oy, mas9283axtg00 Datasheet - Page 10

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mas9283axtg00

Manufacturer Part Number
mas9283axtg00
Description
Ic For 10.00 ? 56.00 Mhz Vcxo
Manufacturer
Micro Analog Systems Oy
Datasheet
SOLDERING INFORMATION
N For Eutectic Sn/Pb
N For Pb-Free
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Moisture Sensitivity Level (MSL)
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Moisture Sensitivity Level (MSL)
Thermal profile parameters stated in JESD22-A113 should not
Thermal profile parameters stated in JESD22-A113 should not
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
Solder plate 7.62 - 25.4 µm, material Matte Tin
be exceeded.
be exceeded.
max 0.08 mm
max 0.08 mm
240°C
http://www.jedec.org
260°C
http://www.jedec.org
2
1
3
1
13 July 2006
DA9283.006
10 (14)

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