SSC-UR201 SEOUL [Seoul Semiconductor], SSC-UR201 Datasheet - Page 6

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SSC-UR201

Manufacturer Part Number
SSC-UR201
Description
Surface-mounted and leadless chip LED device
Manufacturer
SEOUL [Seoul Semiconductor]
Datasheet
4. Soldering profile
(1) Lead Solder
(2) Lead-Free Solder
(3) Hand Soldering Condition
Reflow Soldering Conditions/ Profile
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
• Preliminary heating to be at 150℃max. for 2 minutes max.
• Soldering heat to be at 240℃max. for 5 seconds max.
• Preliminary heating to be at 150℃max. for 2 minutes max.
• Soldering heat to be at 255℃(+5/-0)℃max. for 10 seconds max.
• Not more than 3 seconds @MAX280℃, under Soldering iron.
240
150
120
°C
255
150
120
0
(+5)
°C
0
Pre-heating
Pre-heating
60 to 120 sec.
60 to 120 sec.
Temperature
rise: 5°C/sec.
Temperature
rise: 5°C/sec.
Operation heating
5 to 10 sec.
Operation heating
5sec. max
서식번호 : SSC-QP-7-07-24 (Rev.0.0)
-5°C/sec.
Cooling:
-5°C/sec.
Cooling:
www.ZLED.com
www.ZLED.com
Revision : 1.0
Revision : 1.0
SSC
SSC
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UR201
UR201

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