PMEG6030ETP NXP [NXP Semiconductors], PMEG6030ETP Datasheet
PMEG6030ETP
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PMEG6030ETP Summary of contents
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... PMEG6030ETP High-temperature Schottky barrier rectifier 15 October 2012 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. ...
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... T amb square wave δ kHz; T ≤ 165 °C; sp square wave ms °C; square wave p j(init) All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP Min Typ Max - standard footprint Graphic symbol 1 2 sym001 ...
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... High-temperature Schottky barrier rectifier Conditions T ≤ 25 °C amb Conditions in free air are a significant part of the total power losses standard footprint All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP Min Max - 750 [2] - 1250 [3] - 2500 [1] - 175 -55 175 -65 175 O , standard footprint ...
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... ° 1 ° ° ° All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP 006aab667 (s) p 006aab668 (s) p Min Typ Max - 290 330 - 340 ...
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... R(meas ° / A/µ ° All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP Min Typ Max Unit - 510 590 mV - 405 480 mV - 390 460 mV - 370 450 mV - ...
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... Product data sheet High-temperature Schottky barrier rectifier 0006aad141 I (A) (6) 0.5 0.6 0.7 V (V) F Fig. 5. 006aab883 (V) R Fig. 7. All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP -1 10 ( ...
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... R Fig. 9. 006aad158 I F(AV) (A) (1) (2) (3) ( (V) R Fig. 11. Average forward current as a function of All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP 2.5 2.0 1.5 1.0 0 125 °C j (1) δ (2) δ = 0.5 (3) δ = 0.2 (4) δ = 0.1 Average reverse power dissipation as a function of reverse voltage; typical values 4 ...
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... T (°C) amb 2 Fig. 13. Average forward current as a function of 4.5 (1) I F(AV) (A) 3.0 (2) (3) 1.5 ( 100 All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP 4.5 (1) 3.0 (2) (3) 1.5 ( 100 150 Ceramic PCB standard footprint 175 °C j (1) δ (DC) (2) δ ...
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... High-temperature Schottky barrier rectifier duty cycle δ × δ with I defined as peak current All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP I R(meas) time 006aad022 time V FRM V F time 001aab912 006aac658 = I ...
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... High-temperature Schottky barrier rectifier 2.7 2.3 1 5.0 4.0 4.4 3.6 2 1.9 1.6 Dimensions in mm 6.2 4.4 4.2 1.2 (2×) 1.4 (2×) All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP 1.1 0.9 0.6 0.3 0.22 0.10 07-09-12 solder lands solder resist 1.9 2.1 (2×) (2×) solder paste occupied area Dimensions in mm sod128_fr © NXP B.V. 2012. All rights reserved ...
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... NXP Semiconductors 11. PMEG6030ETP Table 8. Revision history Data sheet ID Release date PMEG6030ETP v.1 20121015 PMEG6030ETP Product data sheet High-temperature Schottky barrier rectifier Data sheet status Change notice Product data sheet All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP ...
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... NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP © NXP B.V. 2012. All rights reserved ...
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... TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. PMEG6030ETP Product data sheet High-temperature Schottky barrier rectifier All information provided in this document is subject to legal disclaimers. 15 October 2012 PMEG6030ETP © NXP B.V. 2012. All rights reserved ...
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... Thermal characteristics .........................................3 7 Characteristics ....................................................... 4 8 Test information ..................................................... 9 8.1 Quality information ......................................... 9 Package outline ................................................... 10 10 Soldering .............................................................. 10 11 PMEG6030ETP ..................................................... 11 12 Legal information .................................................12 12.1 Data sheet status ............................................... 12 12.2 Definitions ...........................................................12 12.3 Disclaimers .........................................................12 12.4 Trademarks ........................................................ 13 © NXP B.V. 2012. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com ...