cxp86460 Sony Electronics, cxp86460 Datasheet - Page 23

• Manufacturer Part Number: cxp86460
• Description: Cmos 8-bit Single Chip Microcomputer
• Manufacturer: Sony Electronics

Package Outline
Unit: mm
LEAD SPECIFICATIONS
1
1
64
64
LEAD MATERIAL
LEAD TREATMENT
LEAD TREATMENT THICKNESS
SONY CODE
EIAJ CODE
JEDEC CODE
SONY CODE
EIAJ CODE
JEDEC CODE
ITEM
57.6 – 0.1
57.6 – 0.1
SDIP-64P-01
P-SDIP64-17.1x57.6-1.778
SDIP-64P-01
P-SDIP64-17.1x57.6-1.778
+ 0.4
+ 0.4
64PIN
64PIN
ALLOY 42
Sn-Bi 2.5%
5-18μm
SDIP (PLASTIC)
SDIP (PLASTIC)
0.9 ± 0.15
0.9 ± 0.15
– 23 –
0.5 ± 0.1
0.5 ± 0.1
SPEC.
1.778
1.778
33
33
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD MATERIAL
PACKAGE MASS
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD MATERIAL
PACKAGE MASS
LEAD TREATMENT
LEAD TREATMENT
32
32
CXP86212/86216, CXP86324/86332, CXP86440/86448/86460
SOLDER PLATING
8.6g
SOLDER PLATING
8.6g
EPOXY RESIN
42/COPPER ALLOY
EPOXY RESIN
42/COPPER ALLOY
0˚ to 15˚
0˚ to 15˚