cxp86460 Sony Electronics, cxp86460 Datasheet - Page 24

• Manufacturer Part Number: cxp86460
• Description: Cmos 8-bit Single Chip Microcomputer
• Manufacturer: Sony Electronics

Package Outline
Unit: mm
52
52
64
64
LEAD SPECIFICATIONS
LEAD MATERIAL
LEAD TREATMENT
LEAD TREATMENT THICKNESS
SONY CODE
JEDEC CODE
SONY CODE
JEDEC CODE
EIAJ CODE
EIAJ CODE
1
1
51
51
ITEM
1.0
1.0
23.9 ± 0.4
20.0 – 0.1
QFP-64P-L01
P-QFP64-14x20-1.0
23.9 ± 0.4
20.0 – 0.1
QFP-64P-L01
P-QFP64-14x20-1.0
+ 0.4
+ 0.4
ALLOY 42
Sn-Bi 2.5%
5-18μm
64PIN QFP (PLASTIC)
64PIN QFP (PLASTIC)
0.4 – 0.1
0.4 – 0.1
SPEC.
+ 0.15
+ 0.15
– 24 –
33
33
19
19
PACKAGE MATERIAL
LEAD MATERIAL
PACKAGE MASS
PACKAGE MATERIAL
LEAD MATERIAL
PACKAGE MASS
PACKAGE STRUCTURE
LEAD TREATMENT
PACKAGE STRUCTURE
LEAD TREATMENT
32
32
20
20
CXP86212/86216, CXP86324/86332, CXP86440/86448/86460
0.2
0.2
2.75 – 0.15
2.75 – 0.15
M
M
+ 0.35
+ 0.35
0
0
1.5g
1.5g
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
˚
˚
to10
to10
˚
˚
0.1 – 0.05
0.1 – 0.05
0.15 – 0.05
0.15 – 0.05
+ 0.2
+ 0.2
+ 0.1
+ 0.1
0.15
0.15