msm6595a Oki Semiconductor, msm6595a Datasheet
msm6595a
Related parts for msm6595a
msm6595a Summary of contents
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... X direction and 1024 words in Y direction can be addressed by inputting external serial addresses. A read and playback device with predetermined messages can easily be configured by storing voice data into the MSM6595A and by combining it with one of Oki's recording and playback ICs and a serial register IC. ...
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... Semiconductor BLOCK DIAGRAM SADX SASX CK SADY SASY CK TAS RDCK CS CS CONTROL Sin Sin MSM6595A-xxx Memory Cell Matrix 131072 ¥ GND TEST TEST MULTIPLEXER TESTO1 TESTO2 MULTIPLEXER DOUT 2/12 ...
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... DD SADY 18 GND SASY TEST 17 DOUT NC 16 TESTO1 RDCK SADX 11 TESTO2 SASX 10 TEST TAS V DD MSM6595A-xxx GND DOUT 3 22 TESTO1 RDCK TESTO2 12 13 ...
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... Pins for testing. Apply a "L" level to the TEST pin and "H" level to the TEST pin. Pins for testing. Leave these pins open. Condition Ta = 25° 25°C IN — STG MSM6595A-xxx Rating Unit –0.3 to +7.0 V –0 +0 –55 to +150 ° ...
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... V = GND 2 RDC Ta = –40 to +70° –0 –40 to +85°C Typical values are at V MSM6595A-xxx Range Unit 2.7 to 5.5 V –40 to +85 ° 2 –40 to +85°C DD Min. Typ. Max. Unit 0.85xV — — — — ...
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CS (I) AX0 AX1 AX2 SADX ( SASX (I) t SAS t SAP t t CSS SSC SADY (I) AY0 AY1 AY2 SASY (I) t SAS t SAP t t SSC CSS ...
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TAS (I) t TAS t t RDC TRS RDCK ( RDP DOUT ( ACC t OFF m+1 n m+2 n 1023 ...
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... AV DD AMON FIN + FOUT ADIN SG DGND + AGND Note: When the MSM6595A is driven by the MSM6388 or MSM6588, a serial register is required. (The MSM6595A does not operate without it.) The MSM6389 is being used as the serial register in the above example SAD SAD SAS SAS TAS ...
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... Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). MSM6595A-xxx (Unit : mm) Package material Epoxy resin ...
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... Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). MSM6595A-xxx (Unit : mm) Package material Epoxy resin ...
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... Semiconductor DIP18-P-300-2.54 MSM6595A-xxx (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating more Solder plate thickness Package weight (g) 1.30 TYP. 11/12 ...
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... Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). MSM6595A-xxx (Unit : mm) Package material Epoxy resin ...
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NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application ...