msm6595a Oki Semiconductor, msm6595a Datasheet - Page 9
msm6595a
Manufacturer Part Number
msm6595a
Description
1-mbit Serial Voice Rom
Manufacturer
Oki Semiconductor
Datasheet
1.MSM6595A.pdf
(13 pages)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
¡ Semiconductor
QFJ18-P-R290-1.27
Spherical surface
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
MSM6595A-xxx
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.50 TYP.
(Unit : mm)
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