emif06-sd03f3 STMicroelectronics, emif06-sd03f3 Datasheet
emif06-sd03f3
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emif06-sd03f3 Summary of contents
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... Removable memory cards in mobile phones, communication systems, and portable applications ■ Compliant with: SD (standard and high speed) /MiniSD/ µSD and MMC/Trans-flash standards Description The EMIF06-SD03F3 is a highly integrated device based on IPAD technology combining the 5 functions described under Features. Rev 1 EMIF06-SD03F3 Flip Chip (24 bumps) ...
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... Line regulation and transient line regulation . . . . . . . . . . . . . . . . . . . . . . . 17 5.2 Load regulation and transient load regulation . . . . . . . . . . . . . . . . . . . . . 18 5.3 Dropout definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2/22 (SD to host) from rising edge CLK skew (read mode) from rising edge CLK skew.f EMIF06-SD03F3 ...
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... EMIF06-SD03F3 1 Functional description A SIDE (Host-CPU) pin list Enable, Dat123.dir, CMD.dir, CMD.h, CLK.h, CLK -f, Dat0.dir, Dat0.h, Dat1.h, Dat2.h, ccA Dat3.h, V bat B SIDE (SD-Card) pin list: WP, CD CMD-B, CLK-B, Dat0-B, Dat1-B, Dat2-B, Dat3-B ccB Table 1. Pin definition Pin name Bump V B3 ccA V B4 ...
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... OUT OUT Figure 3 for pins CMD.B and data bus Dat[0…3].B) VccA 1.8 V ESD 2 kV Clk CMD Data EMIF06-SD03F3 B side signal direction Dat1.h Dat2.h CMD-B CLK-B Dat0-B Dat3 OUT OUT OUT OUT X X OUT ...
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... EMIF06 EMIF06 EMIF06 - - - SD02F3 SD02F3 EMIF06 EMIF06 EMIF06 EMIF06-SD03F3 - - - SD02F3 SD02F3 GND Functional description V bat 15KV 15KV 15KV 15KV 15KV 2 kV 15KV LDO LDO LDO LDO V REF VREF VREF ...
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... The thermal resistance depends on printed circuit board layout. To dissipate the heat efficiently away from Flip Chip bumps better to make copper planes the largest possible as well as considering thermal vias usage. 6/22 Parameter bat = 40 µm, 4 layers (Cu) )/ Rth (j-a) EMIF06-SD03F3 Value Air discharge 2 Contact discharge 2 Air discharge 15 ...
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... EMIF06-SD03F3 Table 4. Recommended operating conditions Symbol Parameter V Power supply ccA V Battery power supply bat I V output current ccB out External battery C bat capacitance External output (1) C out capacitance Equivalent series (2) ESR resistance for C out Ambient operating T aop temperature Juntion operating T jop ...
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... I Quiescent current on V ccB _ON 1. See Note: on page 3 for definition of collective names of pins, for example *.dir 3 Passive integration and low pass filter Figure 4. Circuit diagram of EMIF06-SD03F3 (without LDO) Host side VccA CLK.h CMD.h Data0.h Data1.h Data2.h Data3.h Enable WP ESD 15 kV ...
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... EMIF06-SD03F3 Table 7. Components Symbol Parameter Input capacitance for A C in-A side Input capacitance for B C in-B side Capacitance seen on C EMIF B side from EMIF filter R1, R2, R3, R4, EMIF resistors (2) R5 Line resistance line R10, R11, R12 EMIF resistors (4) R9 EMIF resistor (4) R7 ...
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... GND Dat3 SD input = H, host input = 0 V, host = V *.dir = 3 bat Host input = Host input *.dir = ccA for definition of collective names of pins, for example *.dir EMIF06-SD03F3 Min Typ Max 0. ccA ccA ccA ...
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... EMIF06-SD03F3 Figure 7. Symbol definitions of T INPUT OUTPUT Table 11. ac characteristics Symbol t Propagation delay hl from host to SD phl t Propagation delay lh from host to SD plh t Propagation delay hl from SD to host phl t Propagation delay lh from SD to host plh Rise time from host Rise time from SD to host ...
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... Dat-B CPU CPU EMIF06-SD02F3 EMIF06-SD03F3 t = Tp(CLK.h CLK - B) - Tp(Datx.h skew 50% Tp(Datx.h Datx - B) 50% 50% Tp(CLK.h CLK - B) 50% EMIF06-SD03F3 Test circuit from SD to host HOST SD 15pF 15pF 15pF 15pF 15pF 15pF MiniSD card MiniSD card Datx - B) V ccA Dat ccB Dat ccA CLK ...
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... Figure 11. Example of measurement of t skew.f Datx.h = Dat0.h, Dat1.h, Dat2.h, Dat3.h, CMD.h Datx-B = Dat0-B, Dat1-B, Dat2-B, Dat3-B, CMD.B (read mode) from rising edge CLK.h skew.f t skew.f CLK.h delay CLK.f DAT.dir = « 0 » 5pF DAT.h 5pF CPU EMIF06-SD03F3 ) CLK.h CLK. f – [ Tp(CLK.h 50% Tp(CLK.h CLK - B) 50% 50% Tp(Datx-B ...
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... LOGIC LOGIC V ccA V bat VCCA VBAT VCCA VBAT Level LS LS Shifter 2kV 2kV 500 kΩ EMIF06-SD02F3 (LDO part only) EMIF06-SD03F3 (LDO part only) EMIF06-SD03F3 CBAT C bat VBAT V bat VBAT 2kV 2kV 2 kV VCCB V ccB VCCB V ccB VCCB R,C R,C R,C C out ...
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... EMIF06-SD03F3 Table 12. Static parameters, V Symbol Parameter Regulated output V out voltage (V ) ccB LiR Line regulation LdR Load regulation V Dropout voltage DO Short circuit current I SC limitation Thermal shutdown TSD temperature UVLO Under voltage lockout 1. level shifter disactivated, *.dir = 0, CLK unless otherwise specified ...
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... C to 125° 2.2 µF, Enable L → out ↓ 10% Nom 3 out bat out T = 25° 2.2 µF, Enable H → out EMIF06-SD03F3 Min Typ Max Unit = 200 mA out 4.2 = 3.4 V bat kHz kHz = 200 mA 30 200 = 1 mA 600 ...
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... EMIF06-SD03F3 5.1 Line regulation and transient line regulation The line regulation (LiR static variable that indicates the change in the output voltage of the voltage controller ΔV voltage. By contrast the line transient response (LiTr) represents dynamic peak value to be observed during the change in input voltage Thermal effects due to changes in the junction temperature are circumvented with pulsed voltage during the test and are to be taken into account separately ...
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... C) Iout Vccb Load regulation (LdR) and Load transient (LdTr) versus temperature (typical values - EMIF06-SD03F3 to be taken as the basis for out Time Vfall Time X: 50µs/div Y: 50mA/div X: 50µs/div Y: 10mV/div LdR (mV) LdTr (mV) Temperature ( °c) ...
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... EMIF06-SD03F3 5.3 Dropout definition The dropout voltage (V voltage will drop by 100 mV compared to the output voltage measured at the specified minimum supply voltage (3.1 V). Worst case for dropout is maximum die temperature and maximum current load. This is done statically. Figure 15. Dropout definition 6 Ordering information scheme Figure 16. Ordering information scheme ...
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... Solder mask opening: 300 µm minimum Solder stencil opening : 220 µm recommended 20/22 400 µm ± 40 255 µm± 40 2.1 mm ± 30 µm Figure 19. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) EMIF06-SD03F3 ® 605 µm ± ...
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... Figure 20. Flip Chip tape and reel specifications 0.69 +/- 0.05 All dimensions Ordering information Table 14. Ordering information Order code EMIF06-SD03F3 Note: More information is available in the application notes: AN2348 :"Flip Chip : Package description and recommendations for use" AN1751 : EMI Filters: Recommendations and measurements 9 Revision history Table 15. ...
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