emif06-sd03f3 STMicroelectronics, emif06-sd03f3 Datasheet - Page 20

• Manufacturer Part Number: emif06-sd03f3
• Description: 6-line Ipad?, Emi Filter And Esd Protection For Sd Card
• Manufacturer: STMicroelectronics

Package information
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20/22
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 17. Flip Chip dimensions
Figure 18. Footprint recommendations
Copper pad Diameter:
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening :
220 µm recommended
220 µm recommended
400 µm ± 40
2.1 mm ± 30 µm
255 µm± 40
Figure 19. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
605 µm ± 55
x
y
EMIF06-SD03F3
w
x
E
w
z
®