emif06-msd03f3 STMicroelectronics, emif06-msd03f3 Datasheet - Page 6

• Manufacturer Part Number: emif06-msd03f3
• Manufacturer: STMicroelectronics

Package information
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6/8
Package information
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In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 11. Package dimensions
Figure 12. Footprint
Solder stencil opening:
Copper pad Diameter:
260 µm maximum
Solder mask opening:
300 µm minimum
220 µm recommended
220 µm recommended
Epoxy meets UL94, V0
Lead-free package
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
1.54 mm ± 40 µm
Doc ID 018984 Rev 1
400 µm ± 40
255 µm ± 40
170 µm ± 10
Figure 13. Marking
Dot, ST logo
xx = marking
z = manufacturing
yww = datecode
ECOPACK status
location
y = year,
ww = week
605 µm ± 55
x
y
EMIF06-MSD03F3
w
x
w
z
®