MADP-04 MA-COM [M/A-COM Technology Solutions, Inc.], MADP-04 Datasheet - Page 3

• Manufacturer Part Number: MADP-04
• Description: PIN Diodes for Microwave Switch Designs
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

3
PIN Diodes for Microwave Switch Designs
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
AN3021
Table 2: Relative PIN Diode Performance Evaluation Matrix
Conclusions:
1. Plastic Devices are best suited where Cost is a decision driver, the Operating Frequency < 4 GHz, and the
2. MELF or HIPAX Ceramic Devices are best utilized where Highest Average Power ( > 20 W C.W. ) is the
3. SURMOUNT Devices are probably the Best Overall Compromise in Device Selection. They can Operate
4. Cermachip Devices provide the Best Overall Performance for Operating Frequeny ( 100 MHz – 20
5. Flip Chip Devices are best suited for mmwave Frequencies < 60 GHz, where the RF Incident C.W. < 1W
6. Beam Lead Devices are best suited for mmwave Frequencies < 60 GHz, where the RF Incident C.W. <
100 MHz < F < 20 GHz
100 MHz < F < 4 GHz
20 GHz < F < 60 GHz
20 W < Pinc < 200 W
4 GHz < F < 20 GHz
Relative Cost Index
1 MHz < F < 1 GHz
0.1 W < Pinc < 1 W
1 W < Pinc < 20 W
Key Parameter
RF C.W. Incident Power < 1 W ( + 30 dBm ).
Primary Design Goal and the Operating Frequency < 1 GHz.
( In Various bands ) from 10 MHz – 20 GHz and Perform well with RF Incident Power < 20 W C.W ( + 43
dBm ).
GHz ) , and RF Incident Power < 200 W C.W (+ 53 dBm ).
( + 30 dBm ) and Conductive Epoxy or Soldering is Required.
0.1W ( + 20 dBm ) and Thermo Compression Bonding is Required.
Pinc < 0.1 W
Best Selection
Best Selection
Plastic
Lowest
Surface Mount Assembly
Moderate/Highest Moderate/Highest
MELF or Hi-
Best Selection
Best Selection
Pax
SURMOUNT
Best Selection
Best Selection
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: [phone] • Europe Tel: [phone]
• India Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Best Selection
Best Selection
Cerma Chip
Lowest
Chip & Wire Hybrid Assembly
Best Selection
Best Selection
Flip Chip
Moderate
• China Tel: [phone]
Best Selection
Best Selection
Beam Lead
Highest
Rev. V2