UPD62 NEC [NEC], UPD62 Datasheet - Page 57

• Manufacturer Part Number: UPD62
• Description: 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION
• Manufacturer: NEC [NEC]

15. RECOMMENDED SOLDERING CONDITIONS
Technology Manual (C10535E).
sales representatives.
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material Semiconductor Device Mounting
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
PD62MC-
Caution Using more than one soldering method should be avoided (except in the case of partial
heating).
-5A4: 20-pin plastic SSOP (300 mil)
Package peak temperature: 235 C; time: within 30 secs. max. (210 C or higher);
count: no more than three times
Package peak temperature: 215 C; time: 40 secs. max. (200 C or higher); count:
no more than three times
Solder bath temperature: 260 C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120 C max. (Package surface temperature)
Pin temperature: 300 C or less ; time: 3 secs or less (for each side of the device)
Table 15-1. Soldering Conditions for Surface-Mount Type
Data Sheet U14208EJ1V0DS00
Soldering Condition
Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Recommended
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PD62
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