UPD6124AGS NEC [NEC], UPD6124AGS Datasheet - Page 32

• Manufacturer Part Number: UPD6124AGS
• Description: 4-BIT SINGLE-CHIP MICROCONTROLLER FOR REMOTE CONTROL TRANSMISSION
• Manufacturer: NEC [NEC]

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25. RECOMMENDED SOLDERING CONDITIONS
Mounting Technology Manual” (C10535E).
Caution
Caution
PD6124AGS-XXX: 20-pin plastic SOP (300 mil)
PD6600AGS-XXX: 20-pin plastic SOP (300 mil)
PD6124ACS-XXX: 20-pin plastic shrink DIP (300 mil)
PD6600ACS-XXX: 20-pin plastic shrink DIP (300 mil)
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Wave Soldering (Only for pin part)
Partial Heating
It is recommended that PD6124A and 6600A be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document “Semiconductor Device
For other soldering methods and conditions, consult NEC.
Soldering Method
Soldering Method
Do not use two or more soldering methods in combination (except the partial heating method).
The wave soldering must be performed at the pin part only. Note that the solder must not be directly
contacted to the package body.
Package peak temperature: 230 C, time: 30 seconds max. (210 C min.), number of times: 1
Package peak temperature: 215 C, time: 40 seconds max. (200 C min.), number of times: 1
Soldering bath temperature: 260 C max., time: 10 seconds max., number of times: 1
Pre-heating temperature: 120 C max. (package surface temperature)
Pin temperature: 300 C max., time: 3 seconds max. (per side)
Table 25-1. Soldering Conditions of Surface-Mount Type
Table 25-2. Soldering Conditions of Through-Hole Type
Soldering bath temperature: 260 C max., time: 10 seconds max.
Pin temperature: 300 C max., time: 30 seconds max.
Soldering Conditions
Soldering Conditions
PD6124A, 6600A
Recommended Condition
WS60-00-1
VP15-00-1
IR30-00-1
Symbol for
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