DS26303L-XXX DALLAS [Dallas Semiconductor], DS26303L-XXX Datasheet - Page 79

• Manufacturer Part Number: DS26303L-XXX
• Description: 3.3V, E1/T1/J1, Short-Haul, Octal Line Interface Unit
• Manufacturer: DALLAS [Dallas Semiconductor]

9 THERMAL CHARACTERISTICS
Table 9-1. Thermal Characteristics
Power Dissipation with RIMPMS = 0 (Notes 1, 2)
Power Dissipation with RIMPMS = 1(Notes 1, 2)
Ambient Temperature (Note 3)
Junction Temperature
Theta-JA (θ
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
RCLK1-n = TCLK1-n = 1.544MHz.
Power dissipation with all ports active, TTIP and TRIN driving a 25 Ω load, for an all-ones data density.
The package is mounted on a four-layer JEDEC standard test board.
Theta-JA ( θ
board and the die attach pad is soldered to the test board.
Theta-JA ( θ
board and the die attach pad is not soldered to the test board.
JA
) in Still Air for 144-Pin LQFP with Exposed Pad
JA
JA
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test
PARAMETER
DS26303: 3.3V, T1/E1/J1, Short-Haul, Octal Line Interface Unit
79 of 101
MIN
-40
(Note 4)
(Note 5)
+21.3
TYP
29.0
0.7
0.9
MAX
+125
1.40
1.65
+85
UNITS
°C/W
°C
°C
W
W