UPD70F3102-33 NEC [NEC], UPD70F3102-33 Datasheet - Page 78

• Manufacturer Part Number: UPD70F3102-33
• Description: 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
• Manufacturer: NEC [NEC]

6. RECOMMENDED SOLDERING CONDITIONS
Mounting Technology Manual (C10535E)”.
representative.
78
PD70F3102GJ-33-8EU: 144-pin plastic LQFP (Fine Pitch) (20
Infrared reflow
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document “Semiconductor Device
For soldering methods and conditions other than those recommended below, contact your NEC sales
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution The recommended soldering conditions of the PD70F3102GJ-33-UEN are yet to be determined.
Package peak temperature: 235°C, Time: 30 seconds max. (at
210°C or higher), Count: Twice or less, Exposure limit: 3 days
(after that, prebake at 125°C for 10 hours)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Table 6-1. Surface Mounting Type Soldering Conditions
Preliminary Data Sheet U13844EJ2V0DS00
Soldering Conditions
20)
Note
Recommended Condition Symbol
IR35-103-2
PD70F3102-33
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