NTD20N06L-1 ONSEMI [ON Semiconductor], NTD20N06L-1 Datasheet
NTD20N06L-1
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NTD20N06L-1 Summary of contents
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... MARKING DIAGRAMS 4 4 Drain 3 DPAK 2 Style Drain Gate Source 4 4 Drain 2 3 DPAK Device Code Gate Drain Source = Year = Work Week ORDERING INFORMATION Package Shipping DPAK 75 Units/Rail DPAK 75 Units/Rail Straight Lead DPAK 2500 Tape & Reel Publication Order Number: NTD20N06L/D ...
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... SOURCE−DRAIN DIODE CHARACTERISTICS Forward On−Voltage ( Adc Adc Reverse Recovery Time Reverse Recovery Stored Charge 3. Pulse Test: Pulse Width 300 s, Duty Cycle 4. Switching characteristics are independent of operating junction temperatures. NTD20N06L ( unless otherwise noted) J Symbol V (BR)DSS Vdc ...
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... Gate−to−Source Voltage 1.8 GS 1.6 1.4 1.2 1 0.8 0.6 −50 − JUNCTION TEMPERATURE ( C) J Figure 5. On−Resistance Variation with Temperature NTD20N06L 4 3 100 1 Figure 2. Transfer Characteristics 0.085 0.075 ...
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... GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) NTD20N06L POWER MOSFET SWITCHING The capacitance (C a voltage corresponding to the off−state condition when calculating t on−state when calculating t At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET ...
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... In addition the total r f power averaged over a complete switching cycle must not exceed (T − T )/(R ). J(MAX Power MOSFET designated E−FET can be safely used in switching circuits with unclamped inductive loads. For NTD20N06L 1000 100 ...
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... V , DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area 1 0.5 0.2 0.1 0.05 0.1 0.02 0.01 SINGLE PULSE 0.01 0.00001 0.0001 I Figure 14. Diode Reverse Recovery Waveform NTD20N06L SAFE OPERATING AREA 140 120 10 s 100 100 STARTING JUNCTION TEMPERATURE ( C) J Figure 12. Maximum Avalanche Energy versus ...
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... Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection NTD20N06L interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process ...
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... C. The soldering temperature and time shall not exceed 260 C for more than 10 seconds. NTD20N06L SOLDER STENCIL GUIDELINES pattern of the opening in the stencil for the drain pad is not critical as long as it allows approximately 50% of the pad to be covered with paste. Ç ...
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... C 150 C 100 TIME ( MINUTES TOTAL) NTD20N06L TYPICAL SOLDER HEATING PROFILE The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile ...
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... PL G 0.13 (0.005 −T− SEATING K PLANE 0.13 (0.005) M NTD20N06L PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O SEATING −T− PLANE DPAK CASE 369D−01 ISSUE O C NOTES http://onsemi.com 10 INCHES ...
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... Notes NTD20N06L http://onsemi.com 11 ...
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... N. American Technical Support: 800−282−9855 Toll Free USA/Canada NTD20N06L JAPAN: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 12 NTD20N06L/D ...