CS8363YDPSR7 ONSEMI [ON Semiconductor], CS8363YDPSR7 Datasheet - Page 7

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CS8363YDPSR7

Manufacturer Part Number
CS8363YDPSR7
Description
3.3 V Dual Micropower Regulator with ENABLE and RESET
Manufacturer
ONSEMI [ON Semiconductor]
Datasheet
L1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
7X
D
b
0.13
7X
0.584
M
0.040
B
E
SOLDERING FOOTPRINT*
A
M
E/2
PACKAGE THERMAL DATA
R
R
*Depending on thermal properties of substrate. R
RECOMMENDED
qJC
qJA
e
DIMENSIONS: MILLIMETERS
H
0.424
A
c
Parameter
A
0.050
PITCH
0.310
0.136
DETAIL C
B
c2
A
A
PACKAGE DIMENSIONS
D
SEATING
PLANE
2
PAK−7 (SHORT LEAD)
http://onsemi.com
CASE 936AB−01
Typical
Typical
DPS SUFFIX
ISSUE B
H
D1
7
DETAIL C
M
0.10
qJA
VIEW A−A
= R
E1
M
B
qJC
D
A1
B
L
10−50*
2
A
L3
PAK−7
+ R
3.5
SEATING
PLANE
M
GAUGE
PLANE
qCA
.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. THERMAL PAD CONTOUR OPTIONAL WITHIN
Y14.5M, 1994.
FLASH AND GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.005 MAXIMUM PER SIDE. THESE DIMENSIONS
TO BE MEASURED AT DATUM H.
DIMENSIONS E, L1, D1, AND E1. DIMENSIONS
D1 AND E1 ESTABLISH A MINIMUM MOUNTING
SURFACE FOR THE THERMAL PAD.
DIM
A1
D1
E1
c2
L1
L3
M
A
b
D
E
H
L
c
e
0.170
0.000
0.026
0.017
0.045
0.325
0.270
0.380
0.245
0.539
0.058
MIN
−−−
0.010 BSC
0
0.050 BSC
INCHES
°C/W
°C/W
°
Unit
0.180
0.010
0.036
0.026
0.055
0.368
0.420
0.579
0.078
0.066
MAX
−−−
−−−
8
°
13.69
MILLIMETERS
MIN
4.32
0.00
0.66
0.43
1.14
8.25
9.65
1.47
6.86
6.22
−−−
0
0.25 BSC
1.27 BSC
°
10.67
14.71
MAX
4.57
0.25
0.91
0.66
1.40
9.53
1.98
1.68
−−−
−−−
8
°

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