VND5050J-E_07 STMICROELECTRONICS [STMicroelectronics], VND5050J-E_07 Datasheet - Page 27
![no-image](/images/no-image-200.jpg)
VND5050J-E_07
Manufacturer Part Number
VND5050J-E_07
Description
Double channel high side driver for automotive applications
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.VND5050J-E_07.pdf
(37 pages)
- Current page: 27 of 37
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VND5050J-E / VND5050K-E
4.2
Note:
PowerSSO-24™ thermal data
Figure 34. PowerSSO-24™ PC board
Layout condition of R
area= 77mm x 86mm, PCB thickness=1.6mm, Cu thickness=70µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
Figure 35. R
RTHj_amb(°C/ W)
55
50
45
40
35
30
0
ON)
thj-amb
th
Vs. PCB copper area in open box free air condition (one channel
and Z
2
th
measurements (PCB: Double layer, Thermal Vias, FR4
PCB Cu heatsink area (cm^ 2)
4
2
).
6
Package and PCB thermal data
8
10
27/37
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