TFBS4650-TR4 VISHAY [Vishay Siliconix], TFBS4650-TR4 Datasheet - Page 8

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TFBS4650-TR4

Manufacturer Part Number
TFBS4650-TR4
Description
Infrared Transceiver 9.6 kbit/s to 115.2 kbit/s (SIR)
Manufacturer
VISHAY [Vishay Siliconix]
Datasheet
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS4650 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in
figure 3 is VISHAY's recommended profiles for use
with the TFBS4650 transceivers. For more details
please refer to Application note: SMD Assembly
Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Document Number 84672
Rev. 1.2, 28-May-08
260
240
220
200
180
160
140
120
100
Figure 2. Recommended Solder Profile for Sn/Pb Soldering
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Time/s
For technical questions within your region, please contact one of the following:
200
2...4 °C/s
10 s max. at 230 °C
250
90 s max.
300
19431
350
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned application note, describing manual
soldering and desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Figure 3. Solder Profile, RSS Recommendation
50
(TFDUxxxx
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
Vishay Semiconductors
150
Time/s
and
200
50 s max.
20 s
TFBS4650
TFBSxxx)
T peak = 260 °C max.
250
www.vishay.com
2 °C...4 °C/s
300
are
350
8

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