S29GL-A SPANSION [SPANSION], S29GL-A Datasheet - Page 16
S29GL-A
Manufacturer Part Number
S29GL-A
Description
S29GL-A MirrorBit Flash Family
Manufacturer
SPANSION [SPANSION]
Datasheet
1.S29GL-A.pdf
(89 pages)
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Ordering Information–S29GL016A
Note:
1.
2.
3.
14
S29GL016A
S29GL016A
Type 0 is standard. Specify others as required: TSOP’s can be packed in Types 0 and 3; BGA’s can be packed in Types 0, 2, or 3.
TSOP package marking omits packing type designator from ordering part number.
BGA package marking omits leading S29 and packing type designator from ordering part number.
Number
Device
S29GL016A Standard Products
DEVICE NUMBER/DESCRIPTION
S29GL016A
3.0 Volt-only, 16 Megabit Page-Mode Flash Memory Manufactured on 200 nm MirrorBit™
Process Technology.
Standard products are available in several packages and operating ranges. The
order number (Valid Combination) is formed by a combination of the following:
Valid Combinations list configurations planned to be supported in volume for this
device. Consult your local sales office to confirm availability of specific valid com-
binations and to check on newly released combinations.
10
Option
90, 10
Speed
T
S29GL016A Valid Combinations
A
I
& Temperature Range
Package, Material,
Table 1. S29GL016A Ordering Options
R1
BAI,BFI
TAI,TFI
FAI,FFI
S29GL-A MirrorBit™ Flash Family
0
A d v a n c e
Valid Combinations
PACKING TYPE
0
2
3
Additional Ordering Options
R1
R2
TEMPERATURE RANGE
I
E
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
T
B
F
SPEED OPTION
See Product Selector Guide and Valid Combinations
= Tray
= 7-inch Tape and Reel
= 13-inch Tape and Reel
= x8/x16, V
= x8/x16, V
= Industrial (–40°C to +85°C)
= Engineering Samples (available prior to Production Release only)
= Standard
= Pb-Free
= Thin Small Outline Package (TSOP) Standard Pinout
= Fine-pitch Ball-Grid Array Package
= Fortified Ball-Grid Array Package
protected when WP#/ACC=V
address sectors protected when WP#/ACC=V
Number
R1, R2
Model
I n f o r m a t i o n
CC
CC
=3.0-3.6V, Top boot sector device, top two address sectors
=3.0-3.6V, Bottom boot sector device, bottom two
(Note
Packing
0,2,3
Type
1)
IL
TS048
VBK048
LAA064
(Note
(Note
(Note
Package Description
2)
IL
3)
S29GL-A_00_A3 April 22, 2005
3)
(Notes)
TSOP
Fine-Pitch BGA
Fortified BGA
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