UPC2721 NEC, UPC2721 Datasheet - Page 11

• Manufacturer Part Number: UPC2721
• Description: GENERAL PURPOSE L-BAND DOWN CONVERTER ICs
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
different conditions.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
PC2721/22
Infrared ray reflow
VPS
Wave soldering
Partial heating method
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
For details of recommended soldering conditions for surface mounting, refer to information document
Note Exposure limit before soldering after dry-pack package is opened.
Caution Do not apply more than single process at once, except the “Partial heating method”.
Soldering process
Storage conditions: 25 C and relative humidity at 65 % or less.
Peak package’s surface temperature: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 3, Exposure limit
Peak package’s surface temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 3, Exposure limit
Solder temperature: 260 C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit
Terminal temperature: 300 C or below,
Flow time: 3 seconds or below,
Exposure limitNote: None
Data Sheet P11102EJ4V0DS00
Soldering conditions
Note
Note
Note
: None
: None
: None
PC2721, PC2722
IR35-00-3
VP15-00-3
WS60-00-1
Symbol
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