UPC2745 NEC, UPC2745 Datasheet - Page 17

• Manufacturer Part Number: UPC2745
• Description: 3 V/ SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
• Manufacturer: NEC

NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All
(3) The bypass capacitor should be attached to V
(4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
m m
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Soldering method
PC2745TB,
Infrared ray
reflow
VPS
Wave soldering
Pin part heating
This product should be soldered in the following recommended conditions.
* It is the storage days after opening a dry pack, the storage conditions are 25
Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document
the ground pins must be connected together with wide ground pattern to decrease impedance difference.
m m
PC2746TB
Package peak temperature : 235
°
Package peak temperature : 215
°
Time : 1 times, Limited days : no.*
Pin area temperature : 300
Limited days : no.*
Soldering tub temperature : less than 260
C) Time : 3 times, Limited days : no.*
C) Time : 3 times, Limited days : no.*
Soldering conditions
°
C, Hour : within 3 s/pin.
°
°
C, Hour : within 30 s. (more than 210
C, Hour : within 40 s. (more than 200
CC
line.
°
C, Hour : within 10 s.
PC2745TB,
°
C, less than 65 % RH.
Other soldering methods and
Recommended condition symbol
WS60-00-1
VP15-00-3
IR35-00-3
PC2746TB
17