UPC324 NEC, UPC324 Datasheet - Page 8

• Manufacturer Part Number: UPC324
• Description: LOW POWER QUAD OPERATIONAL AMPLIFIER
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
(C10535E).
Surface mount device
Through-hole device
8
PC324G2: 14-pin plastic SOP (225 mil)
PC324C: 14-pin plastic DIP (300 mil)
Infrared ray reflow
Vapor Phase Soldering
Wave Soldering
Partial heating method
Wave soldering
(only to leads)
Partial heating method
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
Process
Process
the device will be damaged by heat stress.
sure that the package body does not get jet soldered.
Peak temperature: 230 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 1 time.
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 1 time.
Solder temperature: 260 C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 C or below (Package surface temperature).
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (Per each side of the device).
Solder temperature: 260 C or below,
Flow time: 10 seconds or less.
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (per each lead.)
Conditions
Conditions
WS60-00-1
VP15-00-1
IR30-00-1
Symbol
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PC324