PCF8533 Philips Semiconductors, PCF8533 Datasheet - Page 32
PCF8533
Manufacturer Part Number
PCF8533
Description
Universal LCD driver for low multiplex rates
Manufacturer
Philips Semiconductors
Datasheet
1.PCF8533.pdf
(36 pages)
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The position of the bonding pads is not to scale.
Chip dimensions: approximately 5.40
Bump dimensions: 90
Wafer thickness: 381 m.
50
C 2
F
17.5 m.
1.51 mm.
PC8533-2
Fig.22 Bonding pad locations.
0, 0
y
x
C 1
MGL759