CY7C1470V25-167AXI CYPRESS [Cypress Semiconductor], CY7C1470V25-167AXI Datasheet - Page 18

• Manufacturer Part Number: CY7C1470V25-167AXI
• Description: 72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document #: 38-05290 Rev. *I
AC Test Loads and Waveforms
Note:
Capacitance
Thermal Resistance
14. Tested initially and after any design or process changes that may affect these parameters.
C
C
C
C
C
ADDRESS
DATA
CTRL
CLK
I/O
OUTPUT
OUTPUT
Parameter
Parameter
2.5V I/O Test Load
1.8V I/O Test Load
Θ
Θ
JA
JC
[14]
Z
Z
Address Input Capacitance
Data Input Capacitance
Control Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
0
0
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
= 50Ω
= 50Ω
Description
(a)
(a)
V
V
[14]
L
L
Description
= 1.25V
=0.9V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
2.5V
1.8V
INCLUDING
INCLUDING
JIG AND
JIG AND
Test Conditions
SCOPE
SCOPE
5 pF
5 pF
T
A
Test Conditions
= 25°C, f = 1 MHz,
V
V
(b)
(b)
DDQ
DD
R = 1667Ω
R = 14 KΩ
= 2.5V
= 2.5V
R = 1538Ω
R = 14 KΩ
V
DDQ
V
100 TQFP
GND
0.2
Package
DDQ
24.63
100 TQFP
2.28
- 0.2
≤ 1 ns
≤ 1 ns
Max.
6
5
8
6
5
10%
10%
ALL INPUT PULSES
ALL INPUT PULSES
165 FBGA
165 FBGA
Package
Max.
16.3
90%
90%
2.1
6
5
8
6
5
(c)
(c)
CY7C1470V25
CY7C1472V25
CY7C1474V25
209 FBGA
209 FBGA
Package
Max.
15.2
6
5
8
6
5
1.7
Page 18 of 28
90%
90%
10%
10%
≤ 1 ns
≤ 1 ns
Unit
°C/W
°C/W
Unit
pF
pF
pF
pF
pF
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