CY7C1470V25-250AXC CYPRESS [Cypress Semiconductor], CY7C1470V25-250AXC Datasheet - Page 19

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CY7C1470V25-250AXC

Manufacturer Part Number
CY7C1470V25-250AXC
Description
Manufacturer
CYPRESS [Cypress Semiconductor]
Datasheet
Document #: 38-05290 Rev. *E
AC Test Loads and Waveforms
Note:
Capacitance
Thermal Resistance
14. Tested initially and after any design or process changes that may affect these parameters.
C
C
C
C
C
ADDRESS
DATA
CTRL
CLK
I/O
OUTPUT
OUTPUT
Parameters
Parameter
2.5V I/O Test Load
1.8V I/O Test Load
Θ
Θ
JA
JC
[14]
Z
Z
Address Input Capacitance
Data Input Capacitance
Control Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
0
0
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
= 50Ω
= 50Ω
(a)
(a)
V
V
Description
[14]
L
L
Description
= 1.25V
=0.9V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
2.5V
1.8V
INCLUDING
INCLUDING
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA / JESD51.
JIG AND
JIG AND
SCOPE
SCOPE
PRELIMINARY
T
V
V
5 pF
5 pF
A
DD
DDQ
= 25°C, f = 1 MHz,
= 2.5V
Test Conditions
Test Conditions
= 2.5V
(b)
(b)
R = 1667Ω
R = 14KΩ
R = 1538Ω
R = 14KΩ
V
DDQ
V
GND
0.2
DDQ
- 0.2
≤ 1 ns
≤ 1 ns
TQFP
Max.
165 fBGA
Package
6
5
8
6
5
16.3
10%
10%
2.1
ALL INPUT PULSES
ALL INPUT PULSES
209-BGA
Max.
90%
90%
209 BGA
Package
6
5
8
6
5
15.2
1.7
(c)
(c)
CY7C1470V25
CY7C1472V25
CY7C1474V25
165-fBGA
Package Unit
Max.
TQFP
24.63
6
5
8
6
5
2.28
Page 19 of 27
90%
90%
10%
10%
≤ 1 ns
≤ 1 ns
Unit
°C/W
°C/W
pF
pF
pF
pF
pF

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