TDA7402_07 STMICROELECTRONICS [STMicroelectronics], TDA7402_07 Datasheet - Page 69

• Manufacturer Part Number: TDA7402_07
• Description: Car radio signal processor
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

TDA7402
11
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 39. LQFP44 (10x10) Mechanical data and package dimensions
Note: 1. The size of exposed pad is variable depending of lead-
DIM.
ccc
A1
A2
D1
D2
D3
E1
E2
E3
L1
K
A
D
E
b
c
e
L
frame design pad size. End user should verify “D2” and
“E2” dimensions for each device application.
11.80
11.80
MIN.
0.05
1.35
0.30
0.09
9.80
2.00
9.80
2.00
0.45
12.00
10.00
12.00
10.00
TYP.
mm
1.40
0.37
8.00
8.00
0.80
0.60
1.00
3.5˚(min.),7˚(max.)
MAX.
12.20 0.4646 0.4724 0.4803
10.20 0.3858 0.3937 0.4016
12.20 0.4646 0.4724 0.4803
10.20 0.3858 0.3937 0.4016
1.60
0.15 0.0020
1.45 0.0531 0.0551 0.0571
0.45 0.0118 0.0146 0.0177
0.20 0.0035
0.75 0.0177
0.10
0.0787
0.0787
MIN.
0.3150
0.3150
0.0315
0.0394
inch
TYP.
0.0630
0.0059
0.0079
0.0295
0.0039
MAX.
LQFP44 (10 x 10 x 1.40mm)
MECHANICAL DATA
Exposed Pad Down
OUTLINE AND
Package information
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