PCF2120TK NXP [NXP Semiconductors], PCF2120TK Datasheet
PCF2120TK
Related parts for PCF2120TK
PCF2120TK Summary of contents
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PCF2120 Quartz oscillator Rev. 01 — 5 February 2008 1. General description The PCF2120 is a CMOS quartz oscillator optimized for low power consumption. The 32 kHz output signal is gated using an enable signal. 2. Features I Clock operating ...
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... PCF2120 3 OSCO 2 OSCI 7 TEST Pin numbers shown for HSVON10 package. n. CLKOE PCF2120TK 8 CLKOUT n. TEST n.c. SS 001aaf628 Transparent top view Pin configuration HVSON10 package Rev. 01 — 5 February 2008 PCF2120 3 0.85 mm 1.1 ...
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NXP Semiconductors 7.2 Pin description Table 3. Symbol n.c. OSCI OSCO n. n.c. TEST CLKOUT V DD CLKOE 8. Functional description The 32 kHz quartz oscillator is optimized for directly connecting kHz tuning fork quartz ...
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NXP Semiconductors 9. Internal circuitry Fig 5. 10. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg V ...
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NXP Semiconductors 11. Static characteristics Table 5. Static characteristics specified. Symbol Parameter Supply V supply voltage DD I supply current DD Inputs Pin OSCI V input ...
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NXP Semiconductors [2] Pin CLKOUT is loaded with a 7.5 pF capacitor. When pin CLKOUT is enabled the current consumption is a function of the load on that pin, the output frequency and the supply voltage. The additional current consumption ...
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NXP Semiconductors Fig 7. Supply current as a function of ambient temperature 13. Application information You can mount the PCF2120 oscillator together with the quartz crystal as an accurate and pre-tuned quartz oscillator in one package. (1) Do not connect ...
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NXP Semiconductors 14. Package outline HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS ...
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NXP Semiconductors 15. Bare die outline Wire bond die; 7 bonding pads; 0.57 x 1 DIMENSIONS (mm are the original dimensions) UNIT 0.212 mm ...
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NXP Semiconductors 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There ...
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NXP Semiconductors • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is ...
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NXP Semiconductors For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Revision history Table 10. Revision history Document ID Release date PCF2120_1 20080205 PCF2120_1 Product data sheet Data sheet status Change ...
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NXP Semiconductors 18. Legal information 18.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...