TDA8920CJ NXP [NXP Semiconductors], TDA8920CJ Datasheet
TDA8920CJ
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TDA8920CJ Summary of contents
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TDA8920C 2 Rev. 01 — 29 September 2008 1. General description The TDA8920C is a high-efficiency class-D audio power amplifier. The typical output power is 2 The TDA8920C is available in both HSOP24 and DBS23P power packages. The amplifier operates ...
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... Mono bridge-tied load configuration P o [1] The circuit is DC adjusted at V [2] Output power is measured indirectly; based Ordering information Table 2. Ordering information Type number Package Name TDA8920CJ DBS23P TDA8920CTH HSOP24 TDA8920C_1 Preliminary data sheet Quick reference data Conditions = supply voltage Operating mode overvoltage protection Non-Operating mode ...
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... MODE MODE 2 (19) SGND mute 5 (22) IN2P INPUT 4 (21) STAGE IN2M 1 (18) 12 (6) VSSA n.c. Pin numbers in brackets refer to type number TDA8920CJ. Fig 1. Block diagram TDA8920C_1 Preliminary data sheet STABI PROT 18 (12) 13 (7) PWM SWITCH1 MODULATOR CONTROL HANDSHAKE STABI TEMPERATURE SENSOR ...
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... W class-D power amplifier OSC 1 IN1P 2 3 IN1M n.c. 4 n. PROT VDDP1 8 BOOT1 9 10 OUT1 VSSP1 11 TDA8920CJ STABI 12 VSSP2 13 14 OUT2 BOOT2 15 VDDP2 16 17 VSSD 18 VSSA SGND 19 VDDA 20 21 IN2M IN2P 22 MODE 23 001aai854 Pin configuration TDA8920CJ © NXP B.V. 2008. All rights reserved ...
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... PWM signal from a logic level to a high-power PWM signal switching between the main supply lines. A 2nd-order low-pass filter converts the PWM signal to an analog audio signal across the loudspeakers. TDA8920C_1 Preliminary data sheet Pin description Pin Description TDA8920CTH TDA8920CJ 1 18 negative analog supply voltage 2 19 signal ground 3 20 positive analog supply voltage ...
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NXP Semiconductors The TDA8920C single-chip class-D amplifier has built-in high-power switches, drivers, timing and handshaking between the power switches and some control logic. In addition, to secure maximum system robustness, an advanced protection strategy is implemented for voltage, temperature and ...
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NXP Semiconductors To fully charge the coupling capacitors at the inputs, the amplifier automatically remains in the Mute mode before switching to the Operating mode. A complete overview of the start-up timing is shown in (1) First Fig 5. TDA8920C_1 ...
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NXP Semiconductors 8.2 Pulse-width modulation frequency The output signal of the amplifi PWM signal with a carrier frequency typically between 300 kHz and 400 kHz. Using a 2nd-order LC demodulation filter in the application results in an analog ...
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NXP Semiconductors TFB is specified at the thermal foldback activation temperature T closed-loop voltage gain is reduced by 6 dB. The TFB range is: T act(th_fold) The value of T details. 8.3.1.2 OverTemperature Protection (OTP) If despite the TFB function, ...
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NXP Semiconductors If an impedance drop occurs (e.g. due to dynamic behavior of the loudspeaker) OCP is activated. The maximum output current stays limited to 9.2 A but the amplifier will not switch off completely, preventing audio holes from occurring. ...
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NXP Semiconductors Table 4. Protection name Complete [1] TFB OTP OCP WP UVP OVP UBP [1] Amplifier gain depends on the junction temperature and heatsink size. [2] Only complete shutdown of the amplifier if short-circuit impedance is below the threshold ...
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NXP Semiconductors 9. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter ORM T stg T amb MODE V OSC PROT V esd I ...
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NXP Semiconductors 11. Static characteristics Table 7. Static characteristics 345 kHz unless otherwise specified. P osc amb Symbol Parameter Supply V supply voltage P V overvoltage protection supply voltage P(ovp) ...
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NXP Semiconductors Fig 8. 12. Dynamic characteristics 12.1 Switching characteristics Table Symbol Parameter Internal oscillator f osc(typ) f osc External oscillator or frequency tracking V OSC V trip(OSC) f track [1] When using ...
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NXP Semiconductors 12.2 Stereo and dual SE application characteristics Table 9. Dynamic characteristics kHz Symbol Parameter P output power o THD total harmonic distortion G ...
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NXP Semiconductors 12.3 Mono BTL application characteristics Table 10. Dynamic characteristics kHz Symbol Parameter P output power o THD total harmonic distortion G closed-loop voltage ...
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NXP Semiconductors 13. Application information 13.1 Mono BTL application When using the power amplifi mono BTL application, the inputs of both channels must be connected in parallel and the phase of one of the inputs must be inverted; ...
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NXP Semiconductors 13.3.2 Bridge-Tied Load (BTL) Maximum output power 0.5% Maximum output current internally limited to 9 peak Where: • load impedance L • • R DSon(hs) • R DSon(ls) • ...
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NXP Semiconductors 13.5 Noise Noise should be measured using a high-order low-pass filter with a cut-off frequency of 20 kHz. The standard audio band-pass filters used in audio analyzers, do not suppress the residue of the carrier frequency sufficiently to ...
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NXP Semiconductors In the following example, a heatsink calculation is made for supply: The audio signal has a crest factor of 10 (the ratio between peak power and average power (20 dB)), this means that the ...
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... This fully protects the TDA8920C amplifier against short-circuit conditions while at the same time eliminating so-called audio holes resulting from loudspeaker impedance drops. Table 11. Type TDA8920CJ/N1 [1] Overvoltage protection activation caused by supply pumping due to the weak short-circuit; see Section 13.8 Pumping effects In a typical stereo half-bridge SE application the TDA8920C is supplied by a symmetrical voltage (e ...
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NXP Semiconductors 13.9 Application schematics Notes for the application schematic: • Connect a solid ground plane to V emission • Place 100 nF capacitors as close as possible to the TDA8920C power supply pins • Internally connect the internal heat ...
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... Fig 10. Typical application diagram for pop noise-free start up and switch off mode VSSA control VDDP VSSP C VDDP VSSP R OSC 30 k 100 nF 100 nF 100 OUT1 10 BOOT1 9 TDA8920CJ BOOT2 15 OUT2 VDDP VSSP C PROT (1) C STAB 100 nF 100 nF 100 nF 470 VDDP ...
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NXP Semiconductors 13.10 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied to their respective source grounds and must have separate tracks from the power ground tracks. ...
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NXP Semiconductors 13.11 Curves measured in reference design THD (%) (1) OUT2, f (2) OUT2, f (3) OUT2, f Fig 12. THD as a function of output power, SE configuration with 2 THD (%) (1) OUT2, f (2) OUT2, f ...
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NXP Semiconductors THD (%) (1) f (2) f (3) f Fig 14. THD as a function of output power, BTL configuration with 1 THD (%) (1) OUT2, P (2) OUT2, P Fig 15. THD as a function of frequency, SE ...
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NXP Semiconductors THD (%) (1) OUT2, P (2) OUT2, P Fig 16. THD as a function of frequency, SE configuration with 2 THD (%) (1) P (2) P Fig 17. THD as a function of frequency, BTL configuration with 1 ...
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NXP Semiconductors (dB) Fig 18. Channel separation as a function of frequency, SE configuration with 2 (dB) Fig 19. Channel separation as a function of frequency, SE configuration with 2 TDA8920C_1 Preliminary data sheet ...
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NXP Semiconductors P (W) (1) 2 (2) 2 (3) 2 Fig 20. Power dissipation as a function of output power per channel, SE configuration (%) (1) 2 (2) 2 (3) 2 Fig 21. Efficiency as a function of output power ...
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NXP Semiconductors P o (W) (1) THD = (2) THD = 0 THD = (3) THD = (4) THD = 0 (5) THD ...
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NXP Semiconductors G v(cl) (dB) (1) 1 (2) 2 (3) 2 (4) 2 Fig 24. Closed-loop voltage gain as a function of frequency, R SVRR (dB) (1) OUT2, Mute mode. (2) OUT2, Operating mode. (3) OUT2, Standby mode. Fig 25. ...
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NXP Semiconductors SVRR (dB) (1) OUT2, Mute mode. (2) OUT2, Operating mode. (3) OUT2, Standby mode. Fig 26. SVRR as a function of ripple frequency, ripple (V) (1) OUT1, down. (2) OUT1, up. Fig 27. Output voltage ...
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NXP Semiconductors mute (dB) (1) OUT2 (2) OUT2 (3) OUT2 Fig 28. Mute attenuation as a function of frequency TDA8920C_1 Preliminary data sheet (1) (2) ( ...
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NXP Semiconductors 14. Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm DIMENSIONS (mm are the original dimensions) (1) UNIT ...
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NXP Semiconductors HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT ...
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NXP Semiconductors 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 15.1 Introduction ...
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NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including ...
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NXP Semiconductors Fig 31. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 16. Revision history Table 14. Revision history Document ID Release date TDA8920C_1 ...
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NXP Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...