HI5760/6IA INTERSIL [Intersil Corporation], HI5760/6IA Datasheet - Page 18

• Manufacturer Part Number: HI5760/6IA
• Description: 10-Bit, 125/60MSPS, High Speed D/A Converter
• Manufacturer: INTERSIL [Intersil Corporation]

Thin Shrink Small Outline Plastic Packages (TSSOP)
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: [phone]
FAX: [phone]
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
0.10(0.004)
JEDEC MO-153-AE, Issue E.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
feature must be located within the crosshatched area.
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
are not necessarily exact. (Angles in degrees)
2
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
-A-
INDEX
AREA
3
e
0.05(0.002)
b
D
M
C A
For information regarding Intersil Corporation and its products, see web site www.intersil.com
SEATING PLANE
M
E1
-C-
-B-
B S
A
18
E
A1
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: [phone]
FAX: [phone]
0.010
A2
M
0.25
B
M
L
c
HI5760
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A2
E1
A
D
E
N
b
c
e
L
0.002
0.031
0.0075
0.0035
0.378
0.169
0.246
0.0177
MIN
0
-
0.026 BSC
o
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: [phone]
FAX: [phone]
INCHES
28
0.047
0.006
0.051
0.0118
0.0079
0.386
0.177
0.256
0.0295
MAX
8
o
MILLIMETERS
0.05
0.80
0.19
0.09
9.60
4.30
6.25
0.45
MIN
0
-
o
0.65 BSC
28
MAX
1.20
0.15
1.05
0.30
0.20
9.80
4.50
6.50
0.75
8
o
Rev. 0 6/98
NOTES
9
3
4
6
7
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-
-
-
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