MAX5886EGK MAXIM [Maxim Integrated Products], MAX5886EGK Datasheet

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MAX5886EGK

Manufacturer Part Number
MAX5886EGK
Description
3.3V, 12-Bit, 500Msps High Dynamic Performance DAC with Differential LVDS Inputs
Manufacturer
MAXIM [Maxim Integrated Products]
Datasheet

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The MAX5886 is an advanced, 12-bit, 500Msps digital-
to-analog converter (DAC) designed to meet the
demanding performance requirements of signal synthe-
sis applications found in wireless base stations and
other communications applications. Operating from a
single 3.3V supply, this DAC offers exceptional dyna-
mic performance such as 76dBc spurious-free dynamic
range (SFDR) at f
update rates of 500Msps and a power dissipation of
only 230mW.
The MAX5886 utilizes a current-steering architecture,
which supports a full-scale output current range of 2mA
to 20mA, and allows a differential output voltage swing
between 0.1V
The MAX5886 features an integrated 1.2V bandgap ref-
erence and control amplifier to ensure high accuracy
and low noise performance. Additionally, a separate
reference input pin enables the user to apply an exter-
nal reference source for optimum flexibility and to
improve gain accuracy.
The digital and clock inputs of the MAX5886 are
designed for differential low-voltage differential signal
(LVDS)-compatible voltage levels. The MAX5886 is
available in a 68-pin QFN package with an exposed
paddle (EP) and is specified for the extended industrial
temperature range (-40°C to +85°C).
Refer to the MAX5887 and MAX5888 data sheets for
pin-compatible 14- and 16-bit versions of the MAX5886.
19-2776; Rev 2; 12/03
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Performance DAC with Differential LVDS Inputs
Base Stations: Single/Multicarrier UMTS,
CDMA, GSM
Communications: LMDS, MMDS, Point-to-Point
Microwave
Digital Signal Synthesis
Automated Test Equipment (ATE)
Instrumentation
P-P
and 1V
________________________________________________________________ Maxim Integrated Products
OUT
General Description
= 30MHz. The DAC supports
P-P
.
3.3V, 12-Bit, 500Msps High Dynamic
Applications
o 500Msps Output Update Rate
o Single 3.3V Supply Operation
o Excellent SFDR and IMD Performance
o 2mA to 20mA Full-Scale Output Current
o Differential, LVDS-Compatible Digital and Clock
o On-Chip 1.2V Bandgap Reference
o Low 130mW Power Dissipation
o 68-Pin QFN-EP Package
*EP = Exposed paddle.
MAX5886EGK
CLKGND
CLKGND
TOP VIEW
Inputs
DGND
CLKN
DV
VCLK
CLKP
VCLK
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
PD
DD
SFDR = 76dBc at f
IMD = -85dBc at f
ACLR = 70dB at f
PART
10
11
12
13
14
15
16
17
1
2
3
4
5
6
7
8
9
68
18
EP
67
19
20
66
65
21
64
22
-40°C to +85°C
TEMP RANGE
63
23
Ordering Information
OUT
OUT
62
24
OUT
MAX5886
QFN
61
25
= 10MHz
= 61MHz
Pin Configuration
60
26
= 30MHz (to Nyquist)
59
27
28
58
29
57
30
56
31
55
PIN-PACKAGE
68 QFN-EP*
Features
32
54
53
33
52
34
51
50
49
48
47
46
45
44
43
42
41
40
38
37
36
35
39
B7N
B7P
B8N
B8P
B9N
B9P
B10N
B10P
B11N
B11P
DGND
DV
SEL0
N.C.
N.C.
N.C.
N.C.
DD
1

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MAX5886EGK Summary of contents

Page 1

... Excellent SFDR and IMD Performance SFDR = 76dBc at f IMD = -85dBc at f ACLR = 70dB 2mA to 20mA Full-Scale Output Current o Differential, LVDS-Compatible Digital and Clock Inputs o On-Chip 1.2V Bandgap Reference o Low 130mW Power Dissipation o 68-Pin QFN-EP Package PART MAX5886EGK *EP = Exposed paddle. TOP VIEW Applications N.C. 1 N.C. 2 N.C. 3 N.C. ...

Page 2

High Dynamic Performance DAC with Differential LVDS Inputs ABSOLUTE MAXIMUM RATINGS VCLK to AGND................................-0.3V to +3. VCLK to DGND ...............................-0.3V to +3. ...

Page 3

High Dynamic Performance DAC with Differential LVDS Inputs ELECTRICAL CHARACTERISTICS (continued) ( VCLK = 3.3V, AGND = DGND = CLKGND = 0, external reference analog output, 50Ω double terminated (Figure 7), ...

Page 4

High Dynamic Performance DAC with Differential LVDS Inputs ELECTRICAL CHARACTERISTICS (continued) ( VCLK = 3.3V, AGND = DGND = CLKGND = 0, external reference analog output, 50Ω double terminated (Figure 7), ...

Page 5

High Dynamic Performance DAC with Differential LVDS Inputs ELECTRICAL CHARACTERISTICS (continued) ( VCLK = 3.3V, AGND = DGND = CLKGND = 0, external reference analog output, 50Ω double terminated (Figure 7), ...

Page 6

High Dynamic Performance DAC with Differential LVDS Inputs ( VCLK = 3.3V, external reference SFDR vs. OUTPUT FREQUENCY (f = 300MHz -6dB FS) CLK OUT 100 I = 20mA ...

Page 7

High Dynamic Performance DAC with Differential LVDS Inputs PIN NAME 1–8, 23, 34, N.C. Not connected. Do not connect to these pins. Do not tie these pins together. 35–38 9, 41, 60, 62 DGND Digital Ground Digital ...

Page 8

High Dynamic Performance DAC with Differential LVDS Inputs PIN NAME 47 B9N Complementary Data Bit 9 48 B8P Data Bit 8 49 B8N Complementary Data Bit 8 50 B7P Data Bit 7 51 B7N Complementary Data Bit ...

Page 9

High Dynamic Performance DAC with Differential LVDS Inputs DV DGND DD 1.2V REFERENCE REFIO FSADJ CLKN CLKP Figure 1. Simplified MAX5886 Block Diagram Table 1. I and R Selection Matrix Based on a Typical 1.200V Reference Voltage ...

Page 10

High Dynamic Performance DAC with Differential LVDS Inputs 1.2V REFERENCE 10kΩ REFIO 0.1µF FSADJ CURRENT-STEERING I REF R SET DACREF REF REFIO SET Figure 2. Reference Architecture, Internal Reference Configuration Figure 3 displays ...

Page 11

High Dynamic Performance DAC with Differential LVDS Inputs DIGITAL DATA IS LATCHED ON THE RISING EDGE OF CLKP B0 TO B15 SETUP CLKP CLKN IOUT Figure 5. Detailed Timing Relationship ...

Page 12

High Dynamic Performance DAC with Differential LVDS Inputs B0–B11 MAX5886 12 AGND DGND Figure 7. Differential to Single-Ended Conversion Using a Wideband RF Transformer AV DV VCLK DD DD IOUTP B0–B11 MAX5886 IOUTN 12 ...

Page 13

High Dynamic Performance DAC with Differential LVDS Inputs between the frequency components located within the carrier band. The energy at one end of the carrier band generates IM products with the energy from the oppo- site end ...

Page 14

High Dynamic Performance DAC with Differential LVDS Inputs individual carrier must be operated at less than -12dB FS/-18dB FS to avoid waveform clipping. The noise density requirements (Table 2) for a GSM/EDGE-based system can again be derived ...

Page 15

High Dynamic Performance DAC with Differential LVDS Inputs O MEASUREMENT BANDWIDTH -30 30kHz 100kHz -60 -70 -73 -75 -80 -90 0.2 0.4 0.6 1.2 1.8 FREQUENCY OFFSET FROM CARRIER (MHz) Figure 11. GSM/EDGE Tx Mask Requirements supply ...

Page 16

High Dynamic Performance DAC with Differential LVDS Inputs In this package, the data converter die is attached lead frame with the back of this frame exposed at the package bottom surface, facing the PC ...

Page 17

High Dynamic Performance DAC with Differential LVDS Inputs A glitch is generated when a DAC switches between two codes. The largest glitch is usually generated around the midscale transition, when the input pattern transitions from 011...111 to ...

Page 18

High Dynamic Performance DAC with Differential LVDS Inputs (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, (The package drawing(s) in this data sheet may not ...

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