MAX5888AEGK MAXIM [Maxim Integrated Products], MAX5888AEGK Datasheet - Page 16

• Manufacturer Part Number: MAX5888AEGK
• Description: 3.3V, 16-Bit, 500Msps High Dynamic Performance DAC with Differential LVDS Inputs
• Manufacturer: MAXIM [Maxim Integrated Products]

The MAX5888 is packaged in a 68-lead QFN-EP
package (package code: G6800-4), providing greater
design flexibility, increased thermal efficiency**, and
optimized AC performance of the DAC. The exposed
pad (EP) enables the user to implement grounding
techniques, which are necessary to ensure highest per-
formance operation. The EP must be soldered down
to AGND.
In this package, the data converter die is attached to
an EP lead frame with the back of this frame exposed at
the package bottom surface, facing the PC board side
of the package. This allows a solid attachment of the
package to the PC board with standard infrared (IR)
flow soldering techniques. A specially created land pat-
tern on the PC board, matching the size of the EP (6mm
✕
of the DAC. Designing vias*** into the land area and
implementing large ground planes in the PC board
design allow for highest performance operation of the
3.3V, 16-Bit, 500Msps High Dynamic
Performance DAC with Differential LVDS Inputs
**Thermal efficiency is not the key factor, since the MAX5888 features low-power operation. The exposed pad is the key element to
***Vias connect the land pattern to internal or external copper planes. It is important to connect as many vias as possible to the analog
Figure 13. Recommended Power-Supply Decoupling and Bypassing Circuitry
16
6mm), ensures the proper attachment and grounding
ensure a solid ground connection between the DAC and the PC board’s analog ground layer.
ground plane to minimize inductance.
______________________________________________________________________________________
16
B0–B15
AV
BYPASSING—DAC LEVEL
DD
AGND
DV
MAX5888
0.1µF
DD
DGND
VCLK
0.1µF
CLKGND
0.1µF
OUTP
OUTN
1µF
1µF
1µF
DAC. An array of at least 4
per via hole and 1.2mm pitch between via holes) is rec-
ommended for this 68-lead QFN-EP package.
Integral nonlinearity is the deviation of the values on an
actual transfer function from either a best straight line fit
(closest approximation to the actual transfer curve) or a
line drawn between the end points of the transfer func-
tion, once offset and gain errors have been nullified. For
a DAC, the deviations are measured at every individual
step.
Differential nonlinearity is the difference between an
actual step height and the ideal value of 1 LSB. A DNL
error specification of less than 1 LSB guarantees no
missing codes and a monotonic transfer function.
Static Performance Parameter Definitions
AV
DV
VCLK
DD
DD
10µF
10µF
10µF
BYPASSING—BOARD LEVEL
FERRITE BEAD
FERRITE BEAD
FERRITE BEAD
47µF
47µF
47µF
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
✕
4 vias (≤0.3mm diameter
ANALOG POWER-
SUPPLY SOURCE
DIGITAL POWER-
SUPPLY SOURCE
CLOCK POWER-
SUPPLY SOURCE