PCA9624BS NXP [NXP Semiconductors], PCA9624BS Datasheet

PCA9624BS

Manufacturer Part Number

PCA9624BS

Description

8-bit Fm+ I2C-bus 100 mA 40 V LED driver

Manufacturer

NXP [NXP Semiconductors]

Datasheet

1.PCA9624BS.pdf (37 pages)

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1. General description

The PCA9624 is an I

dimming and blinking 100 mA Red/Green/Blue/Amber (RGBA) LEDs. Each LED output

has its own 8-bit resolution (256 steps) ﬁxed frequency individual PWM controller that

operates at 97 kHz with a duty cycle that is adjustable from 0 % to 99.6 % to allow the

LED to be set to a speciﬁc brightness value. An additional 8-bit resolution (256 steps)

group PWM controller has both a ﬁxed frequency of 190 Hz and an adjustable frequency

between 24 Hz to once every 10.73 seconds with a duty cycle that is adjustable from 0 %

to 99.6 % that is used to either dim or blink all LEDs with the same value.

Each LED output can be off, on (no PWM control), set at its individual PWM controller

value or at both individual and group PWM controller values. The PCA9624 operates with

a supply voltage range of 2.3 V to 5.5 V and the 100 mA open-drain outputs allow

voltages up to 40 V.

The PCA9624 is one of the ﬁrst LED controller devices in a new Fast-mode Plus (Fm+)

family. Fm+ devices offer higher frequency (up to 1 MHz) and more densely populated bus

operation (up to 4000 pF).

The active LOW Output Enable input pin (OE) blinks all the LED outputs and can be used

to externally PWM the outputs, which is useful when multiple devices need to be dimmed

or blinked together without using software control.

Software programmable LED Group and three Sub Call I

deﬁned groups of PCA9624 devices to respond to a common I

for example, all red LEDs to be turned on or off at the same time or marquee chasing

effect, thus minimizing I

126 devices on the same bus.

The Software Reset (SWRST) Call allows the master to perform a reset of the PCA9624

through the I

their default state causing the outputs to be set HIGH (LED off). This allows an easy and

quick way to reconﬁgure all device registers to the same condition.

The PCA9624 and PCA9634 software is identical and if the PCA9624 on-chip 100 mA

NAND FETs do not provide enough current or voltage to drive the LEDs, then the

PCA9634 with larger current or higher voltage external drivers can be used.

PCA9624

8-bit Fm+ I

Rev. 02 — 26 August 2009

C-bus, identical to the Power-On Reset (POR) that initializes the registers to

C-bus 100 mA 40 V LED driver

C-bus controlled 8-bit LED driver optimized for voltage switch

C-bus commands. Seven hardware address pins allow up to

C-bus addresses allow all or

C-bus address, allowing

Product data sheet

Related parts for PCA9624BS

PCA9624BS Summary of contents

Page 1

PCA9624 8-bit Fm+ I Rev. 02 — 26 August 2009 1. General description The PCA9624 dimming and blinking 100 mA Red/Green/Blue/Amber (RGBA) LEDs. Each LED output has its own 8-bit resolution (256 steps) ﬁxed frequency individual PWM ...

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NXP Semiconductors 2. Features I 8 LED drivers. Each output programmable at: N Off Programmable LED brightness N Programmable group dimming/blinking mixed with individual LED brightness I 1 MHz Fast-mode Plus compatible I on SDA output for ...

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... LED displays I LCD backlights I Keypad backlights for cellular phones or handheld devices 4. Ordering information Table 1. Ordering information Type number Topside mark PCA9624BS 9624 PCA9624PW PCA9624PW PCA9624_2 Product data sheet Package Name Description HVQFN24 plastic thermal enhanced very thin quad ﬂat package; no leads; 24 terminals; body 4 TSSOP24 plastic thin shrink small outline package ...

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PCA9624 SCL INPUT FILTER SDA POWER- RESET V SS PWM REGISTER X BRIGHTNESS CONTROL 24.3 kHz 97 kHz 25 MHz OSCILLATOR OE Remark: Only one LED output shown for clarity. Fig 1. Block diagram of PCA9624 A0 A1 ...

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... Rev. 02 — 26 August 2009 PCA9624 2 8-bit Fm+ I C-bus 100 LED driver terminal 1 index area PCA9624BS LED0 5 LED1 6 Transparent top view Fig 3. Pin conﬁguration for HVQFN24 Type Description [1] power supply supply ground I address input 0 ...

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NXP Semiconductors [1] HVQFN24 package supply ground is connected to both V be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using ...

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NXP Semiconductors The last bit of the address byte deﬁnes the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. 7.1.2 LED All Call I • Default power-up ...

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NXP Semiconductors 7.2 Control register Following the successful acknowledgement of the slave address, LED All Call address or LED Sub Call address, the bus master will send a byte to the PCA9624, which will be stored in the Control register. ...

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NXP Semiconductors AI[2:0] = 110 is used when the LED drivers must be globally programmed with different settings during the same I blinking change. AI[2:0] = 111 is used when individual and global changes must be performed during the 2 ...

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NXP Semiconductors 7.3.1 Mode register 1, MODE1 Table 5. Legend: * default value. Bit Symbol 7 AI2 6 AI1 5 AI0 4 SLEEP 3 SUB1 2 SUB2 1 SUB3 0 ALLCALL [1] It takes 500 s max. for the oscillator ...

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NXP Semiconductors 7.3.3 PWM0 to PWM7, individual brightness control Table 7. Legend: * default value. Address 02h 03h 04h 05h 06h 07h 08h 09h A 97 kHz ﬁxed frequency signal is used for each output. Duty cycle is controlled through ...

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NXP Semiconductors 7.3.5 GRPFREQ, group frequency Table 9. Legend: * default value. Address 0Bh GRPFREQ is used to program the global blinking period when DMBLNK bit (MODE2 register) is equal to 1. Value in this register is a ‘Don’t care’ ...

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NXP Semiconductors 7.3.7 SUBADR1 to SUBADR3, I Table 11. Legend: * default value. Address 0Eh 0Fh 10h Subaddresses are programmable through the I E4h, E8h, and the device(s) will not acknowledge these addresses right after power-up (the corresponding SUBx bit ...

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NXP Semiconductors 7.4 Active LOW output enable input The active LOW output enable (OE) pin, allows to enable or disable all the LED outputs at the same time. • When a LOW level is applied to OE pin, all the ...

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NXP Semiconductors b. Byte 2 = 5Ah: the PCA9624 acknowledges this value only. If byte 2 is not equal to 5Ah, then the PCA9624 does not acknowledge it. If more than 2 bytes of data are sent, the PCA9624 does ...

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NXP Semiconductors 8. Characteristics of the I 2 The I C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be ...

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NXP Semiconductors SDA SCL MASTER TRANSMITTER/ RECEIVER Fig 10. System conﬁguration 8.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed ...

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NXP Semiconductors 9. Bus transactions slave address START condition (1) See Table 4 for register deﬁnition. Fig 12. Write to a speciﬁc register slave address ...

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NXP Semiconductors slave address START condition R/W acknowledge from slave data from MODE2 register (cont.) A acknowledge from master data from last read byte (cont not acknowledge STOP ...

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NXP Semiconductors 10. Application design-in information V = 2 C-BUS/SMBus MASTER SDA SCL OE (1) OE requires pull-up resistor if control signal from the master is open-drain. ...

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NXP Semiconductors 10.1 Junction temperature calculation A device junction temperature can be calculated when the ambient temperature or the case temperature is known. When the ambient temperature is known, the junction temperature is calculated using Equation 4 power dissipation. T ...

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NXP Semiconductors 10.1.1 Example known R th(j-a) T amb LED output low voltage (LED V LED output current per channel = 80 mA Number of outputs = 8 I DD(max) V DD(max C-bus clock (SCL) ...

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NXP Semiconductors 1. Find P – output current (60 mA – output current (50 mA – output current (40 mA – output current (20 mA – output current (1 mA Output total power = 341.5 mW – chip core power ...

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NXP Semiconductors Table 14. Measurement amb maximum power dissipation (chip + output drivers) maximum power dissipation (output drivers only) maximum drive current per channel amb maximum power dissipation (chip + output drivers) ...

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NXP Semiconductors 13. Static characteristics Table 16. Static characteristics Symbol Parameter Supply V supply voltage DD I supply current DD I standby current stb V power-on ...

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NXP Semiconductors [3] Tested with outputs off 4.5 V (A) 3.0 V 0.25 2.3 V 0.15 0.05 0.05 0.05 0. amb amb ...

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NXP Semiconductors 14. Dynamic characteristics Table 17. Dynamic characteristics Symbol Parameter f SCL clock frequency SCL t bus free time between a BUF STOP and START condition t hold time (repeated) HD;STA START condition t set-up time for a SU;STA ...

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NXP Semiconductors [ minimum time for SDA data out to be valid following SCL LOW. VD;DAT [3] A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the ...

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NXP Semiconductors 15. Test information Fig 21. Test circuitry for switching times PCA9624_2 Product data sheet V I PULSE GENERATOR R = Load resistor for LEDn. R for SDA and SCL > less current). L ...

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NXP Semiconductors 16. Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. ...

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NXP Semiconductors HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 0.85 mm terminal 1 index area terminal 1 24 index area DIMENSIONS (mm are ...

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NXP Semiconductors 17. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 18. Soldering of SMD packages ...

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NXP Semiconductors • Process issues, such as application of adhesive and ﬂux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath speciﬁcations, including temperature and impurities ...

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NXP Semiconductors Fig 24. Temperature proﬁles for large and small components For further information on temperature proﬁles, refer to Application Note AN10365 “Surface mount reﬂow soldering description” . 19. Abbreviations Table 20. Acronym CDM DUT ESD FET HBM 2 I ...

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NXP Semiconductors Table 20. Acronym RGB RGBA SMBus 20. Revision history Table 21. Revision history Document ID Release date PCA9624_2 20090826 • Modiﬁcations: Section 7.4 “Active LOW output enable • Figure 17 “Typical • Added (new) • Section 11 “Limiting ...

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NXP Semiconductors 21. Legal information 21.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualiﬁcation Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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