ADV7441ABSTZ-110 AD [Analog Devices], ADV7441ABSTZ-110 Datasheet - Page 10

• Manufacturer Part Number: ADV7441ABSTZ-110
• Description: 10-Bit Integrated, Multiformat SDTV/HDTV Video Decoder, RGB Graphics Digitizer, and 2:1 Multiplexed HDMI/DVI Interface
• Manufacturer: AD [Analog Devices]

ADV7441A
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD to AGND
DVDD to DGND
PVDD to PGND
DVDDIO to DGND
CVDD to CGND
TVDD to TGND
DVDDIO to AVDD
DVDDIO to TVDD
DVDDIO to DVDD
CVDD to DVDD
PVDD to DVDD
AVDD to CVDD
AVDD to PVDD
AVDD to DVDD
AVDD to TVDD
TVDD to DVDD
Digital Inputs
Digital Outputs
Analog Inputs
Maximum Junction
Storage Temperature Range
Infrared Reflow,
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Voltage to DGND
Voltage to DGND
Voltage to AGND
Temperature (T
Soldering (20 sec)
J
_
MAX
)
Rating
2.2 V
2.2 V
2.2 V
4 V
2.2 V
4 V
−0.3 V to +3.6 V
−3.6 V to +3.6 V
−2 V to +2 V
−2 V to +0.3 V
−2 V to +0.3 V
−2 V to +2 V
−2 V to +2 V
−2 V to +0.3 V
−3.6 V to +0.3 V
−2 V to +2 V
DGND − 0.3 V to DVDDIO + 0.3 V
DGND − 0.3 V to DVDDIO + 0.3 V
AGND − 0.3 V to AVDD + 0.3 V
125°C
−65°C to +150°C
260°C
Rev. B | Page 10 of 28
THERMAL RESISTANCE
Table 6.
Package Type
144-Lead LQFP (ST-144)
1
PACKAGE THERMAL PERFORMANCE
To reduce power consumption during ADV7441A operation,
turn off unused ADCs.
On a four-layer PCB that includes a solid ground plane, the
value of θ
PCB metal and, therefore, variations in PCB heat conductivity,
the value of θ
The most efficient measurement technique is to use the surface
temperature of the package to estimate the die temperature,
because this is not affected by the variance associated with the
value of θ
The maximum junction temperature (T
be exceeded. The following equation calculates the junction
temperature using the measured surface temperature of the
package and applies only when no heat sink is used on DUT:
where:
T
Celsius.
Ψ
W
(DVDDIO × IDVDDIO) + (PVDD × IPVDD) +
(CVDD × ICVDD) + (TVDD × ITVDD)}.
Contact an Analog Devices, Inc., sales representative or send an
e-mail to
package thermal performance.
ESD CAUTION
Junction-to-package surface thermal resistance.
S
JT
TOTAL
is the surface temperature of the package expressed in degrees
is the junction-to-package surface thermal resistance.
T
J
_
= {(AVDD × IAVDD) + (DVDD × IDVDD) +
MAX
JA
[e-mail]
JA
.
is 25.3°C/W. However, due to variations within the
= T
JA
S
may differ for various PCBs.
+ (Ψ
JT
× W
TOTAL
)
for more information on
J
_
MAX
Ψ
1.62
) of 125°C must not
JT
1
Unit
°C/W